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Hardware Installation and Reference Guide Preparing for Installation
Find out the location of the emergency power supply switch in the room before installation. First cut off the power
supply in case of an accident.
Be sure to make a careful check before you shut down the power supply.
Do not place the device in a damp/wet location. Do not let any liquid enter the chassis
Keep the AP far away from the grounding or lightning protection devices of power equipment.
Keep the AP away from radio stations, radar stations, high-frequency high-current devices, and microwave ovens.
Any nonstandard and inaccurate electrical operation can cause an accident such as fire or electric shock, thus
causing severe even fatal damages to human bodies and device.
Direct or indirect touch through a wet object on high voltage and power line can bring a fatal danger.
Ventilation
For proper ventilation, leave sufficient space around the AP.
Temperature and Humidity
To ensure normal operation and service life of the device, maintain appropriate temperature and humidity levels in your
equipment room. See Table 2-1. Improper room temperature and humidity can cause damages to the device.
High relative humidity may affect insulation materials, resulting in poor insulation and even electrical leakage, and
sometimes may lead to change of mechanical properties of materials and corrosion of metal parts.
Low relative humidity may dry and shrink insulation sheets and cause static electricity that can damage the circuitry
inside the device.
High temperature greatly reduces reliability of the device and shortens its service life.
Table 2-1 Required Temperature and Humidity for the RG-AP740-I
Temperature
Relative Humidity
-10 to 55
º
C
5% to 95%
Cleanness
Dust poses a serious threat to device operation. Dust that falls onto the surface of the device can be absorbed onto metal
contact points by static electricity, resulting in poor contact. Electrostatic absorption of dust occurs more easily when the
relative humidity is low, which may shorten the service life of the device and cause communication failures. Table 2-2
shows the maximum concentration and diameter of dust allowed in the equipment room.
Table 2-2
