RC11xx(HP)-TM
RC25xx(HP)-TM
RC17xx(HP)-TM
2016 Radiocrafts AS
RC11xx(HP)/25xx(HP)/17xx(HP)-TM Data Sheet rev. 1.48 Page 71 of 86
2016 Tiny Mesh AS
Radiocrafts
Embedded Wireless Solutions
Mechanical Drawing
Mechanical Dimensions
The module size is 12.7 x 25.4 x 3.3 mm.
Note: Not all pads shown for RC17XX(HP)-TM. Please reference PCB LAYOUT RECOMMENDATIONS
for complete pad pattern.
Carrier Tape and Reel Specification
Carrier tape and reel is in accordance with EIA Specification 481.
Tape width
Component
pitch
Hole pitch
Reel
diameter
Units per reel
44 mm
16 mm
4 mm
13”
Max 1000
Soldering Profile Recommendation
JEDEC standard IEC/JEDEC J-STD-020B (page 11 and 12), Pb-Free Assembly is recommended.
The standard requires that the heat dissipated in the “surroundings” on the PCB is taken into account.
The peak temperature should be adjusted so that it is within the window specified in the standard for the
actual motherboard.
Aperture for paste stencil is normally areal-reduced by 20-35%. Nominal stencil thickness of 0.1 -0-12
mm is recommended. Consult your production facility for best experience aperture reduction.
Cleaning and welding Recommendation
Ultrasonic processes
like ultrasonic cleaning and ultrasonic welding to assemble plastic enclosures can
cause deterioration or destruction of components inside the module. Please avoid ultrasonic processes
on products that include any of the RC11xxHP module variants in the design.