RC11xx(HP)-TM
RC25xx(HP)-TM
RC17xx(HP)-TM
2016 Radiocrafts AS
RC11xx(HP)/25xx(HP)/17xx(HP)-TM Data Sheet rev. 1.48 Page 70 of 86
2016 Tiny Mesh AS
Radiocrafts
Embedded Wireless Solutions
PCB Layout Recommendations
The recommended layout pads for the module are shown in the figures below. All dimensions are in
thousands of an inch (mil). The circle in upper left corner is an orientation mark only, and should not be
a part of the copper pattern.
The RC17xx(HP)-TM layout pattern covers all solder pads for all module versions, and is recommended
for PCB designs in products that require flexibility in module selection.
RC11XX(HP)-TM, RC25xx(HP)-TM
RC17xx(HP)-TM
A PCB with two or more layers and with a
single,
solid ground plane in
one
of the
inner
- or
bottom
layer(s) is recommended. Multiple GND layers should be avoided, as it is challenging to achieve
sufficiently low impedance between multiple layers. All GND-pins of the module shall be connected to
this ground plane with vias with shortest possible routing, one via per GND-pin.
On the backside of the module, there are several test pads. These test pads shall not be connected, and
the area underneath the module should be covered with solder resist. If any routing or vias is required
under the module, the routing and vias must be covered with solder resist to prevent short-circuiting of
the test pads. It is recommended that vias be tented.
Reserved pins should be soldered to the pads but the pads must be left floating.
Note that Radiocrafts technical support team is available for schematic and layout review of your design.