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Le présent appareil est con

forme aux CNR d’ ISED applicables aux appareils radio exempts de licence.

L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage
préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de

provoquer un fonctionnement indésirable.

Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation

de dispositif module)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les

utilisateurs, et

2) Le module émetteur peut ne pas être coï

mplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas

nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour

toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co- location

with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not

be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating

the end product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est

plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,

Содержание SC200R Series

Страница 1: ...SC200R SC262R Series Hardware Design Smart Module Series Version 1 2 Date 2022 05 23 Status Released ...

Страница 2: ...rred by use of or reliance upon the information All information supplied herein is subject to change without prior notice Disclaimer While Quectel has made efforts to ensure that the functions and features under development are free from errors it is possible that these functions and features could contain errors inaccuracies and omissions Unless otherwise provided by valid agreement Quectel makes...

Страница 3: ... devices may cause interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions such as when the mobile bill is unpaid or the U SIM card is invalid When emer...

Страница 4: ... Fi receiving sensitivity Chapter 4 1 1 5 Added BT transmitting and receiving performance Chapter 4 2 1 6 Added GNSS performance data Chapter 5 1 7 Added current consumption of SC200R CE NA Chapter 7 4 8 Added RF output power of SC200R NA Chapter 7 5 9 Added RF receiving sensitivity of SC200R CE NA Chapter 7 6 10 Updated the maintenance clearance between the module and other components to at least...

Страница 5: ...apter 7 5 Added RF output power of SC200R EM 4 Chapter 7 6 Updated RF receiving sensitivity of SC200R CE EM NA 5 Chapter 9 1 Updated notes for the storage conditions 6 Chapter 9 2 Updated the recommended reflow soldering thermal profile parameters 1 3 2022 5 23 Winston 1 Add SC262R WF ...

Страница 6: ... 1 Power Supply Pins 40 3 4 2 Decrease Voltage Drop 40 3 4 3 Reference Design for Power Supply 41 3 5 Turn on and off Scenarios 42 3 5 1 Turn on the Module Using PWRKEY 42 3 5 2 Turn off the Module 44 3 6 VRTC Interface 44 3 7 Power Output 45 3 8 Battery Charging and Management 46 3 9 USB Interface 48 3 10 UART Interfaces 50 3 11 U SIM Interfaces 51 3 12 SD Card Interface 54 3 13 GPIO Interfaces 5...

Страница 7: ...erating Frequencies 81 6 1 2 Reference Design for Main and Rx diversity Antenna Interfaces 84 6 2 Wi Fi Bluetooth Antenna Interface 85 6 3 GNSS Antenna Interface 86 6 3 1 Recommended Circuit for Passive Antenna 87 6 3 2 Recommended Circuit for Active Antenna 87 6 4 Reference Design for RF Layout 88 6 5 Antenna Installation 90 6 5 1 Antenna Requirements 90 6 5 2 Recommended RF Connector for Antenna...

Страница 8: ...Smart Module Series SC200R SC262R_Series_Hardware_Design 7 124 9 2 Manufacturing and Soldering 116 9 3 Packaging 118 10 Appendix References 120 ...

Страница 9: ...0 Pin Definition of SPI Interfaces 59 Table 21 Pin Definition of ADC Interface 60 Table 22 Pin Definition of Motor Drive Interface 60 Table 23 Pin Definition of LCM Interface 61 Table 24 Pin Definition of Touch Panel Interface 63 Table 25 Pin Definition of Camera Interface 65 Table 26 MIPI Trace Length Inside the Module 68 Table 27 Pin Definition of Sensor Interfaces 70 Table 28 Pin Definition of ...

Страница 10: ...P Current Consumption 102 Table 51 SC200R CE RF Output Power 103 Table 52 SC200R EM RF Output Power 104 Table 53 SC200R NA RF Output Power 105 Table 54 SC200R JP RF Output Power 106 Table 55 SC200R CE RF Receiving Sensitivity 107 Table 56 SC200R EM RF Receiving Sensitivity 107 Table 57 SC200R NA RF Receiving Sensitivity 108 Table 58 SC200R JP RF Receiving Sensitivity 109 Table 59 ESD Characteristi...

Страница 11: ... Figure 21 Reference Design for External Backlight Driving Circuit 63 Figure 22 Reference Circuit Design for TP Interface 64 Figure 23 Reference Circuit Design for 3 Camera Applications 67 Figure 24 Reference Circuit Design for ECM Microphone Interface 71 Figure 25 Reference Circuit Design for MEMS Microphone Interface 72 Figure 26 Reference Circuit Design for Earpiece Interface 72 Figure 27 Refer...

Страница 12: ...ure 42 Bottom Dimensions Bottom View 112 Figure 43 Recommended Footprint Top View 113 Figure 44 Top and Bottom Views of the Module 114 Figure 45 Recommended Reflow Soldering Thermal Profile 117 Figure 46 Tape Dimensions Unit mm 118 Figure 47 Reel Dimensions Unit mm 119 ...

Страница 13: ...couraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help This device complies with FCC radiation ex...

Страница 14: ...62RWF The FCC ID can be used only when all FCC compliance requirements are met Antenna Installation 1 The antenna must be installed such that 20 cm is maintained between the antenna and users 2 The transmitter module may not be co located with any other transmitter or antenna 3 Only antennas of the same type and with equal or less gains as shown below may be used with this module Other types of an...

Страница 15: ...M integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed Cet appareil est conç u uniquement pour les inté grateurs OEM dans les conditions suivantes Pour utilisation de dispositif module 1 L antenne doit ê tre installé e de telle sorte qu une distance de 20 cm est respectée entre l antenne et les utilisateurs et ...

Страница 16: ...s le manuel de l utilisateur du produit final qui intègre ce module Le manuel de l utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiquédans ce manuel RSS 247 Section 6 4 5 6 for local area network devices 5GHz The device could automatically discontinue transmission in case of absence of information to transmit or operational failure Note th...

Страница 17: ...s in the band 5725 5850 MHz shall be such that the equipment still complies with the e i r p limits as appropriate and iii where applicable antenna type s antenna models s and worst case tilt angle s necessary to remain compliant with the e i r p elevation mask requirement set forth in section 6 2 2 3 shall be clearly indicated 1 1 Special Mark Table 1 Special Mark Mark Definition Unless otherwise...

Страница 18: ...r GPS Galileo Beidou satellite positioning systems Supports multiple audio and video codecs Built in high performance AdrenoTM 308 graphics processing unit Provides multiple audio and video input output interfaces as well as abundant GPIO interfaces SC200R series module is available in below variants SC200R CE SC200R EM SC200R NA SC200R JP SC200R WF SC262RWF The following tables show the supported...

Страница 19: ... WCDMA B1 B2 B4 B5 B8 GSM 850 900 1800 1900 MHz Wi Fi 802 11a b g n 2412 2472 MHz 5180 5825 MHz Bluetooth 4 2 LE 2402 2480 MHz GNSS GPS 1575 42 1 023 MHz GLONASS 1597 5 1605 8 MHz BeiDou 1561 098 2 046 MHz Galileo 1575 42 1 023 MHz Mode Frequency LTE FDD B2 B4 B5 B7 B12 B13 B14 B17 B25 B26 B66 B71 LTE TDD B41 WCDMA B2 B4 B5 Wi Fi 802 11a b g n 2412 2472 MHz 5180 5825 MHz Bluetooth 4 2 LE 2402 2480...

Страница 20: ...1 B18 B19 B21 B26 B28 LTE TDD B41 WCDMA B1 B6 B8 B19 Wi Fi 802 11a b g n 2402 2482 MHz 5180 5825 MHz Bluetooth 4 2 LE 2402 2480 MHz GNSS GPS 1575 42 1 023 MHz GLONASS 1597 5 1605 8 MHz BeiDou 1561 098 2 046 MHz Galileo 1575 42 1 023 MHz Mode Frequency Wi Fi 802 11a b g n 2412 2472 MHz 5180 5825 MHz Bluetooth 4 2 LE 2402 2480 MHz GNSS Mode Frequency Wi Fi 802 11a b g n ac 2412 2462 MHz 5180 5825 MH...

Страница 21: ... Processor 64 bit quad core ARM Cortex A53 microprocessor up to 1 3 GHz 512 KB L2 cache Modem DSP Hexagon DSP v56 core up to 691 MHz 768 KB L2 cache GPU AdrenoTM 308 GPU with 64 bit addressing up to 485 MHz Memory 8 GB eMMC 1 GB LPDDR3 default 16 GB eMMC 2 GB LPDDR3 optional Operating System Android 10 Power Supply Supply voltage 3 55 4 2 V Typical supply voltage 3 8 V Transmitting Power Class 4 3...

Страница 22: ...ss 33 33 by default Coding scheme CS 1 CS 2 CS 3 and CS 4 Max 107 kbps DL Max 85 6 kbps UL EDGE Supports EDGE multi slot class 33 33 by default Supports GMSK and 8 PSK for different MCS Downlink coding schemes MCS 1 9 Uplink coding schemes MCS 1 9 Max 296 kbps DL Max 236 8 kbps UL WLAN Features Supports AP and STA mode 2 4 GHz 5 GHz 802 11a b g n up to 150 Mbps Bluetooth Feature Bluetooth 4 2 LE G...

Страница 23: ... is supported UART2 debug UART 2 wire UART interface used for debugging by default UART1 2 wire UART interface SD Card Interface Supports SD 3 0 Supports SD card hot plug U SIM Interfaces Two U SIM interfaces Supports USIM SIM card 1 8 V or 2 95 V Supports Dual SIM Dual Standby supported by default I2C Interfaces Four I2C interfaces Used for peripherals such as camera sensor touch panel etc ADC In...

Страница 24: ...uency Baseband LPDDR3 eMMC flash Peripheral interfaces USB interface UART interfaces U SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interfaces ADC interface Motor drive interface LCM interface Touch panel interface Camera interfaces Audio interfaces 2 4 Evaluation Board To help you design and test applications with the module Quectel supplies an evaluation kit which includes...

Страница 25: ...ters provide the detailed description of pins interfaces listed below Power supply VRTC interface USB interface Power output Battery charging and management UART interfaces U SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interfaces ADC interface Motor drive interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces Emergency download in...

Страница 26: ...Pins AUDIO Pins USB Pins U SIM Pins UART Pins GPIO Pins ANT Pins TP Pins LCM Pins CAMERA Pins OTHERS Pins RESERVED Pins 24 SDCARD Pins 254 VBAT_BB VBAT_BB GND MIC1_P MIC_GND MIC2_P GND EAR_P EAR_N SPK_P SPK_N GND USB_DM USB_DP GND USB_ID USIM2_DET USIM2_RST USIM2_CLK USIM2_DATA USIM2_VDD USIM1_DET USIM1_RST USIM1_CLK USIM1_DATA USIM1_VDD GND VIB_DRV_N PWM TP_INT TP_RST SD_LDO12 GPIO_33 UART5_TXD U...

Страница 27: ...gital input output OD Open drain PI Power input PO Power output PIO Power input output Power Supply Pin Name Pin No I O Description DC Characteristics Comment VBAT_BB 1 2 PIO Power supply for the module s baseband part Vmax 4 2 V Vmin 3 55 V Vnom 3 8 V You must provide them with sufficient current of up to 3 A It is suggested to add a TVS for surge protection VBAT_RF 145 146 PI Power supply for th...

Страница 28: ...ot used keep it open LDO10_2V85 156 PO 2 85 V output power supply Vnom 2 85 V IOmax 150 mA Reserved power supply If it is used add a 1 0 2 2 μF bypass capacitor If it is not used keep it open LDO17_2V85 129 PO 2 85 V output power supply Vnom 2 85 V IOmax 450 mA Power supply for AVDD of LCM TP sensors and cameras If it is used connect an external 2 2 4 7 μF capacitor to this pin in parallel If it i...

Страница 29: ...nce ground If it is not used connect it to the ground MIC2_P 6 AI Microphone input for headset EAR_P 8 AO Earpiece output EAR_N 9 AO Earpiece output SPK_P 10 AO Speaker output SPK_N 11 AO Speaker output HPH_R 136 AO Headphone right channel output HPH_REF 137 AO Headphone reference ground HPH_L 138 AO Headphone left channel output HS_DET 139 AI Headset hot plug detect High level by default MIC_BIAS...

Страница 30: ...ault U SIM Interfaces Pin Name Pin No I O Description DC Characteristics Comment USIM2_DET 17 DI U SIM2 card hot plug detect VILmax 0 63 V VIHmin 1 17 V Active low Externally pull it up to 1 8 V If it is not used keep it open This function is disabled by default via software Cannot be multiplexed into a generic GPIO USIM2_RST 18 DO U SIM2 card reset VOLmax 0 4 V VOHmin 0 8 USIM2_VDD Cannot be mult...

Страница 31: ...function is disabled by default via software Cannot be multiplexed into a generic GPIO USIM1_RST 23 DO U SIM1 card reset VOLmax 0 4 V VOHmin 0 8 USIM1_VDD Cannot be multiplexed into generic GPIOs USIM1_CLK 24 DO U SIM1 card clock USIM1_DATA 25 DIO U SIM1 card data VILmax 0 2 USIM1_VDD VIHmin 0 7 USIM1_VDD VOLmax 0 4 V VOHmin 0 8 USIM1_VDD USIM1_VDD 26 PO U SIM1 card power supply IOmax 55 mA For 1 ...

Страница 32: ...35 V UART1_RXD 153 DI UART1 receive VILmax 0 63 V VIHmin 1 17 V UART1_TXD 154 DO UART1 transmit VOLmax 0 45 V VOHmin 1 35 V SD Card Interface Pin Name Pin No I O Description DC Characteristics Comment SD_LDO11 38 PO 2 95 V output power supply for SD card Vnom 2 95 V IOmax 800 mA SD_LDO12 32 PO 1 8 2 95 V output power supply for SD card pull up circuits Vnom 1 8 2 95 V IOmax 50 mA SD_CLK 39 DO SD c...

Страница 33: ...power domain Active low TP_I2C_SCL 47 OD TP I2C clock Externally pull them up to 1 8 V Can be used for other I2C devices TP_I2C_SDA 48 OD TP I2C data LCM Interface Pin Name Pin No I O Description DC Characteristics Comment PWM 29 DO PWM output VOLmax 0 45 V VOHmax VBAT_BB Adjusts backlight brightness LCD_RST 49 DO LCD reset VOLmax 0 45 V VOHmin 1 35 V 1 8 V power domain LCD_TE 50 DI LCD tearing ef...

Страница 34: ... CSI1_LN0_N 65 AI Camera MIPI data 0 CSI1_LN0_P 66 AI Camera MIPI data 0 CSI1_LN1_N 67 AI Camera MIPI data 1 CSI1_LN1_P 68 AI Camera MIPI data 1 CSI1_LN3_N 70 AI Camera MIPI data 3 CSI1_LN3_P 71 AI Camera MIPI data 3 CSI1_LN2_N 72 AI Camera MIPI data 2 CSI1_LN2_P 73 AI Camera MIPI data 2 CSI0_CLK_N 157 AI Camera MIPI clock CSI0_CLK_P 196 AI Camera MIPI clock CSI0_LN0_N 158 AI Camera MIPI data 0 CS...

Страница 35: ...era CAM_I2C_SCL 83 OD I2C clock of camera Externally pull them up to 1 8 V CAM_I2C_SDA 84 OD I2C data of camera CAM2_MCLK 165 DO Clock of camera VOLmax 0 45 V VOHmin 1 35 V 1 8 V power domain CAM2_RST 164 DO Reset of camera CAM2_PWDN 163 DO Power down of camera DCAM_I2C_SCL 166 OD I2C clock of camera Externally pull them up to 1 8 V DCAM_I2C_SDA 205 OD I2C data of camera Keypad Interfaces Pin Name...

Страница 36: ...nsor Dedicated for external sensors Cannot be used for touch panel NFC I2C keyboard etc Externally pull them up to 1 8 V SENSOR_I2C_ SDA 92 OD I2C data of external sensor Charging Interface Pin Name Pin No I O Description DC Characteristics Comment BAT_SNS 133 AI Battery voltage detect The maximum input voltage is 4 2 V BAT_THERM 134 AI Battery temperature detect Internally pulled up Supports 47 k...

Страница 37: ...87 AIO Main antenna interface 50 Ω impedance ANT_DRX 131 AI Rx diversity antenna interface ANT_GNSS 2 121 AI GNSS antenna interface ANT_WIFI BT 77 AIO Wi Fi Bluetooth antenna interface GPIO Interfaces Pin Name Pin No I O Description DC Characteristics Comment GPIO_33 33 DIO General purpose input output VILmax 0 63 V VIHmin 1 17 V VOLmax 0 45 V VOHmin 1 4 V 1 8 V power domain GPIO_25 90 DIO General...

Страница 38: ...purpose input output GPIO_42 110 DIO General purpose input output GPIO_93 112 DIO General purpose input output GPIO_46 113 DIO General purpose input output GPIO_89 115 DIO General purpose input output GPIO_23 116 DIO General purpose input output GPIO_22 117 DIO General purpose input output GPIO_21 118 DIO General purpose input output GPIO_20 119 DIO General purpose input output GPIO_62 123 DIO Gen...

Страница 39: ...NA Enable Interface Pin Name Pin No I O Description DC Characteristics Comment GNSS_LNA_EN 194 DIO External GNSS LNA enable Cannot be multiplexed into a generic GPIO GRFC Interfaces Pin Name Pin No I O Description DC Characteristics Comment RFFE3_CLK 260 DIO GRFC used for RF tuner control Cannot be multiplexed into generic GPIOs RFFE3_DATA 262 DIO GRFC used for RF tuner control Emergency Download ...

Страница 40: ...n motor driver output control VO 1 2 3 1 V IOmax 175 mA Connect it to the negative pole of the motor Indication Interface Pin Name Pin No I O Description DC Characteristics Comment CHG_LED 195 AO Indicates the module s charging status IOmax 5 mA Other Interfaces Pin Name Pin No I O Description DC Characteristics Comment NFC_CLK 181 DO NFC clock NFC_CLK_REQ 182 DI NFC clock request CBL_PWR_N 186 DI...

Страница 41: ...off automatically Therefore make sure the input voltage never drops below 3 1 V 3 1 V Voltage 3 8 V 3 A Input current Figure 2 Voltage Drop Sample To decrease voltage drop use a bypass capacitor of about 100 µF with low ESR ESR 0 7 Ω and reserve a multi layer ceramic chip capacitor MLCC array due to its ultra low ESR It is recommended to use three ceramic capacitors 100 nF 33 pF 10 pF to compose t...

Страница 42: ...s module should be able to provide sufficient current of at least 3 A If the voltage drop between the input and output is not too high it is suggested to use an LDO to supply power for the module If there is a big voltage difference between the input source and the desired output VBAT a buck converter is recommended The following figure shows a reference design for 5 V input power source The typic...

Страница 43: ...oftware or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip 3 5 Turn on and off Scenarios 3 5 1 Turn on the Module Using PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1 6 s The PWRKEY pin is pulled up to 1 8 V internally It is recommended to use an open drain collector driver to control PWRKEY A simple reference circui...

Страница 44: ...for ESD protection A reference circuit is shown in the following figure PWRKEY S1 Close to S1 TVS 1K Figure 6 Turn on the Module Using Keystroke The turning on scenario is illustrated in the following figure VBAT Typ 3 8 V PWRKEY 1 6 s Others LDO5_1V8 38 s LDO6_1V8 47 ms Software controlled LDO17_2V85 Active Note2 Software controlled Figure 7 Timing of Turning on the Module ...

Страница 45: ...in low for at least 1 s and then choose to turn off the module when the prompt window comes up You can also force the module to power off by driving PWRKEY low for at least 8 s The forced power down scenario is illustrated in the following figure VBAT PWRKEY Others 8 s Power down Figure 8 Timing of Turning off the Module 3 6 VRTC Interface The RTC Real Time Clock can be powered by an external powe...

Страница 46: ...ue is 3 0 V 3 7 Power Output SC200R series module supports output of regulated voltages for peripheral circuits During application it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high frequency noise Table 10 Power Description Pin Name Default Voltage V Driving Current mA Idle State LDO5_1V8 1 8 20 Keeps ON LDO6_1V8 1 1 8 150 LDO10_2V85 2 85 150 LD...

Страница 47: ...etween 2 8 V and 3 2 V the charging current can be set to 450 mA maximally Constant current mode CC mode When the battery is increased to 3 2 4 2 V the system will switch to CC mode The maximum charging current is 1 44 A when an adapter is used for battery charging and the maximum charging current is 450 mA for USB charging Constant voltage mode CV mode When the battery voltage reaches the final v...

Страница 48: ...1 μF C2 NM_1 nF C4 Figure 10 Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries For different batteries you should modify the charging and discharging curve correspondingly to achieve the best performance If the thermistor is not available in the battery or an adapter is utilized to power the module you must connect B...

Страница 49: ...external USB port for USB ID detection When you insert a device into the external USB port the USB_ID pin of the module will be pulled down to make the module enter host mode You can choose either to support USB OTG or not The following figures show the reference designs USB_DP USB_DM USB_VBUS 1 2 3 4 5 USB_DP USB_DM VUSB USB_ID GND GND GND GND GND 6 7 8 9 100 nF Module C1 D1 D2 D3 ESD ESD ESD GND...

Страница 50: ...impedance of USB differential trace should be controlled to 90 Ω Keep the ESD protection devices as close as possible to the USB connector Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines Typically the capacitance value should be less than 2 pF Do not route signal traces under crystals oscillators magnetic devices or RF signal traces Route the USB ...

Страница 51: ...ed with a 3 3 V UART interface The following figure shows the reference design VCCA VCCB OE A1 A2 A3 A4 GND B1 B2 B3 B4 LDO5_1V8 UART5_RTS UART5_RXD UART5_CTS UART5_TXD RTS_3 3V RXD_3 3V CTS_3 3V TXD_3 3V VDD_3 3V C1 100 pF C2 U1 100 pF Figure 13 Reference Circuit with Level Translator Chip for UART5 Pin Name Pin No I O Description Comment UART5_TXD 34 DO UART5 transmit 1 8 V power domain If not u...

Страница 52: ...ND UART5_RXD UART5_TXD UART5_RTS UART5_RXD UART5_CTS Figure 14 RS 232 Level Match Circuit for UART5 UART2 and UART1 are similar to UART5 For the reference design refer to that of UART5 3 11 U SIM Interfaces SC200R series module provides two U SIM interfaces that meet ETSI and IMT 2000 requirements Dual SIM Dual Standby is supported by default Either 1 8 V or 2 95 V U SIM card is supported and the ...

Страница 53: ...DD NM R6 Figure 15 Reference Circuit for U SIM Interface with an 8 pin U SIM Card Connector USIM2_RST 18 DO U SIM2 card reset Cannot be multiplexed into generic GPIOs USIM2_CLK 19 DO U SIM2 card clock USIM2_DATA 20 DIO U SIM2 card data USIM2_VDD 21 PO U SIM2 card power supply Either 1 8 V or 2 95 V U SIM card is supported USIM1_DET 22 DI U SIM1 card hot plug detect Active low Externally pull it up...

Страница 54: ... SIM card signals away from RF and VBAT traces Reserve a filter capacitor for USIM_VDD and its maximum capacitance should not exceed 1 μF Additionally place the capacitor near the U SIM card connector To avoid cross talk between USIM_DATA and USIM_CLK keep them away from each other and shield them with ground USIM_RST also needs ground protection In order to ensure good ESD protection it is recomm...

Страница 55: ...33R 33R 33R 33R 1K 33 pF 4 7 μF SD_LDO12 Module R1 R2 R3 R4 R5 R6 NM_51K NM_10K NM_51K NM_51K R7 R8 R9 R10 R11 R12 R13 D1 D2 D3 D4 D5 D6 D7 D8 C1 C2 SD Card Connector LDO 5_1V8 GND R14 0R Figure 17 Reference Circuit for SD Card Interface Pin Name Pin No I O Description Comment SD_CLK 39 DO SD card clock 50 Ω characteristic impedance SD_CMD 40 DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_...

Страница 56: ...eed signal lines In PCB design control the characteristic impedance of them to 50 Ω and do not cross them with other traces It is recommended to route the traces on the inner layer of PCB and keep them of the same length Additionally SD_CLK needs ground shielding separately Layout guidelines Control the impedance to 50 Ω 10 and add ground shielding The trace length difference between SD_CLK and ot...

Страница 57: ...akeup 2 GPIO_13 102 GPIO_13 B PD nppukp Wakeup GPIO_20 119 GPIO_20 B PD nppukp GPIO_21 118 GPIO_21 B PD nppukp Wakeup GPIO_22 117 GPIO_22 B PD nppukp GPIO_23 116 GPIO_23 B PD nppukp GPIO_25 90 GPIO_25 B PD nppukp Wakeup GPIO_33 33 GPIO_33 B PD nppukp GPIO_34 170 GPIO_34 B PD nppukp Wakeup GPIO_39 201 GPIO_39 B PD nppukp GPIO_42 110 GPIO_42 B PD nppukp Wakeup GPIO_43 107 GPIO_43 B PD nppukp Wakeup ...

Страница 58: ...8 B PD nppukp GPIO_89 115 GPIO_89 B PD nppukp GPIO_90 177 GPIO_90 B PD nppukp Wakeup GPIO_93 112 GPIO_93 B PD nppukp Wakeup GPIO_94 104 GPIO_94 B PD nppukp GPIO_95 103 GPIO_95 B PD nppukp GPIO_127 169 GPIO_127 B PD nppukp Wakeup GPIO_130 97 GPIO_130 B PD nppukp Wakeup SD_DET 45 GPIO_67 B PD nppukp Wakeup TP_INT 30 GPIO_65 B PD nppukp Wakeup TP_RST 31 GPIO_64 B PD nppukp TP_I2C_SCL 47 GPIO_11 B PD ...

Страница 59: ...kp Wakeup CAM0_PWDN 80 GPIO_126 B PD nppukp Wakeup CAM1_RST 81 GPIO_129 B PD nppukp CAM1_PWDN 82 GPIO_125 B PD nppukp CAM2_MCLK 165 GPIO_27 B PD nppukp CAM2_RST 164 GPIO_38 B PD nppukp Wakeup CAM2_PWDN 163 GPIO_41 B PD nppukp Wakeup VOL_UP 95 GPIO_91 B PD nppukp Wakeup VOL_DOWN 96 GPIO_50 B PD nppukp Wakeup UART5_TXD 34 GPIO_16 B PD nppukp UART5_RXD 35 GPIO_17 B PD nppukp Wakeup UART5_CTS 36 GPIO_...

Страница 60: ... interfaces These interfaces can only support master mode and can be used for fingerprint recognition Table 20 Pin Definition of SPI Interfaces Pin Name Pin No I O Description Comment TP_I2C_SCL 47 OD TP I2C clock Used for touch panel TP_I2C_SDA 48 OD TP I2C data CAM_I2C_SCL 83 OD I2C clock of camera Used for camera CAM_I2C_SDA 84 OD I2C data of camera DCAM_I2C_SCL 166 OD I2C clock of camera Used ...

Страница 61: ...an be multiplexed into SPI6_CS GPIO_23 116 DO SPI6 clock Can be multiplexed into SPI6_CLK GPIO_20 119 DO SPI6 data output Can be multiplexed into SPI6_MOSI GPIO_21 118 DI SPI6 data input Can be multiplexed into SPI6_MISO GPIO_87 105 DO SPI7 chip select Can be multiplexed into SPI7_CS GPIO_85 265 DO SPI7 data output Can be multiplexed into SPI7_MOSI GPIO_88 264 DO SPI7 clock Can be multiplexed into...

Страница 62: ...ge to components 3 18 LCM Interface SC200R series module provides one LCM interface which is MIPI_DSI standard compliant The interface supports high speed differential data transmission and supports HD display 1440 720 60 fps The pin definition of the LCM interface is shown below Table 23 Pin Definition of LCM Interface Pin Name Pin No I O Description Comment LDO17_2V85 129 PO 2 85 V output power ...

Страница 63: ... 18 19 20 21 22 23 24 25 26 27 MIPI_TDP0 MIPI_TDN0 GND MIPI_TCP MIPI_TCN 29 28 30 3 4 5 6 3 4 5 6 3 4 5 6 3 4 5 6 DSI_LN1_N DSI_LN1_P DSI_LN0_N DSI_LN0_P 1 2 3 4 5 6 11 1 2 1 2 1 2 1 2 100 nF 4 7 μF 1 μF Module LCM FL1 FL2 FL3 FL4 FL5 EMI filter C3 C2 C1 NC GND GND GND GND GPIO_61 31 32 33 34 DSI OUT GND IN EN 1 8 V VBAT 1 μF 10K GND Figure 19 Reference Circuit Design for LCM Interface DSI_LN0_N 5...

Страница 64: ...C pin You can design the external backlight driving circuit for LCM according to actual requirements A reference circuit design is shown in the following figure in which the PWM pin is used to adjust the backlight brightness LCM_LED PWM Module 2 2 μF Backlight driver LCM_LED VBAT C1 Figure 20 Reference Design for External Backlight Driving Circuit 3 19 Touch Panel Interface SC200R series module pr...

Страница 65: ... 100 nF Module RESET 1 8 V SCL 1 8 V SDA 1 8 V INT 1 8 V GND VDD 2 85 V TP R2 R1 C1 C2 D1 D2 D3 D4 D5 LDO17_2V85 GND Figure 21 Reference Circuit Design for TP Interface TP_INT 30 DI TP interrupt 1 8 V voltage domain TP_RST 31 DO TP reset 1 8 V voltage domain Active low TP_I2C_SCL 47 OD TP I2C clock Externally pull them up to 1 8 V Can be used for other I2C devices TP_I2C_SDA 48 OD TP I2C data ...

Страница 66: ...DOVDD of camera Vnom 1 8 V IOmax 150 mA LDO17_2V85 129 PO 2 85 V output power supply for AVDD of camera Vnom 2 85 V IOmax 450 mA CSI1_CLK_N 63 AI Camera MIPI clock CSI1_CLK_P 64 AI Camera MIPI clock CSI1_LN0_N 65 AI Camera MIPI data 0 CSI1_LN0_P 66 AI Camera MIPI data 0 CSI1_LN1_N 67 AI Camera MIPI data 1 CSI1_LN1_P 68 AI Camera MIPI data 1 CSI1_LN3_N 70 AI Camera MIPI data 3 CSI1_LN3_P 71 AI Came...

Страница 67: ...of camera CAM0_RST 79 DO Reset of camera CAM0_PWDN 80 DO Power down of camera CAM1_RST 81 DO Reset of camera CAM1_PWDN 82 DO Power down of camera CAM_I2C_SCL 83 OD I2C clock of camera Externally pull them up to 1 8 V CAM_I2C_SDA 84 OD I2C data of camera CAM2_MCLK 165 DO Clock of camera 1 8 V power domain CAM2_RST 164 DO Reset of camera CAM2_PWDN 163 DO Power down of camera DCAM_I2C_SDA 205 OD I2C ...

Страница 68: ...1_LN3_P CSI1_LN3_N CSI1_LN2_P CSI1_LN2_N CSI1_LN1_P CSI1_LN1_N CSI1_LN0_P CSI1_LN0_N CSI0_CLK_P CSI0_CLK_N CSI1_CLK_P CSI1_CLK_N LDO6_1V8 2 2K 2 2K camera0 connector 1 μF 4 7μF 4 7μF 1 μF 1 μ F 4 7μF CAM2_RST CAM1_PWDN CAM1_MCLK CAM_I2C_SDA _ CAM_I2C_SCL CAM1_RST camera1 connector AVDD DVDD DOVDD EMI EMI EMI EMI EMI EMI EMI EMI 1μF 2 2K 2 2K DVDD EMI EMI 4 7 1μF μF AVDD DOVDD OUT GND IN EN LDO VBA...

Страница 69: ...IPI traces of the same length In order to avoid crosstalk keep a distance of 1 5 times the trace width among MIPI signal lines During impedance matching do not connect GND on different planes to ensure impedance consistency It is recommended to select a low capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF Route MIPI traces according to the following...

Страница 70: ...10 67 CSI1_LN1_N 18 15 0 05 68 CSI1_LN1_P 18 20 70 CSI1_LN3_N 18 10 0 10 71 CSI1_LN3_P 18 20 72 CSI1_LN2_N 18 05 0 05 73 CSI1_LN2_P 18 10 157 CSI0_CLK_N 22 60 0 05 196 CSI0_CLK_P 22 55 158 CSI0_LN0_N 22 55 0 05 197 CSI0_LN0_P 22 50 159 CSI0_LN1_N 20 25 0 05 198 CSI0_LN1_P 20 30 160 CSI0_LN2_N 20 50 0 00 199 CSI0_LN2_P 20 50 161 CSI0_LN3_N 12 95 0 00 200 CSI0_LN3_P 12 95 ...

Страница 71: ...e Pin No I O Description Comment SENSOR_I2C_SCL 91 OD I2C clock of external sensor Dedicated for external sensors Cannot be used for touch panel NFC I2C keyboard etc Externally pull them up to 1 8 V SENSOR_I2C_SDA 92 OD I2C data of external sensor GPIO_43 107 DI Light sensor interrupt GPIO_44 109 DI Compass sensor interrupt GPIO_42 110 DI Accelerometer sensor interrupt GPIO_63 108 DI Gyroscope sen...

Страница 72: ...he headphone interface features stereo left and right channel output and supports headphone insertion detect 3 22 1 Reference Circuit Design for Microphone Interfaces MIC1_P ECM MIC R2 R1 Module D1 MIC_GND 33 pF C1 0R 0R R3 0R Figure 23 Reference Circuit Design for ECM Microphone Interface MIC3_P 148 AI Microphone input for channel 2 MIC_BIAS1 147 AO Microphone bias voltage 1 VO 1 6 2 85 V EAR_P 8...

Страница 73: ...ND 0R C1 MIC_BIAS1 1 2 3 4 F1 D1 OUT GND GND VDD 100nF C4 0R 33 pF Figure 24 Reference Circuit Design for MEMS Microphone Interface 3 22 2 Reference Circuit Design for Earpiece Interface EAR_P EAR_N R2 33 pF 33 pF 33 pF C2 C3 C1 R1 Module D1 D2 0R 0R Figure 25 Reference Circuit Design for Earpiece Interface ...

Страница 74: ...le D1 D2 Figure 27 Reference Circuit Design for Loudspeaker Interface 3 22 5 Design Considerations for Audio Interfaces It is recommended to use the electret microphone with dual built in capacitors e g 10 pF and 33 pF to filter out RF interference thus reducing TDD noise The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900 Without this capacitor ...

Страница 75: ... In order to decrease radio or other signal interference place RF antennas away from audio interfaces and audio traces Additionally keep power traces far away from the audio traces and do not route them in parallel Route the differential audio traces according to the differential signal layout rule 3 23 Emergency Download Interface USB_BOOT is an emergency download interface You can force the modu...

Страница 76: ...rts 2 4 GHz and 5 GHz dual band WLAN based on IEEE 802 11a b g n standard protocols The maximum data rate is up to 150 Mbps The features are as below Supports Wake on WLAN WoWLAN Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP mode Supports Wi Fi Direct Supports MCS 0 7 for HT20 and HT40 4 1 1 Wi Fi Performance The following table lists the Wi Fi transmitting and receiving ...

Страница 77: ...Mbps 13 dBm 2 5 dB 802 11n HT20 MCS0 14 dBm 2 5 dB 802 11n HT20 MCS7 13 dBm 2 5 dB 802 11n HT40 MCS0 14 dBm 2 5 dB 802 11n HT40 MCS7 13 dBm 2 5 dB Standard Rate Sensitivity 2 4 GHz 802 11b 1 Mbps 96 802 11b 11 Mbps 87 802 11g 6 Mbps 90 802 11g 54 Mbps 73 802 11n HT20 MCS0 89 802 11n HT20 MCS7 71 802 11n HT40 MCS0 89 802 11n HT40 MCS7 69 5 GHz 802 11a 6 Mbps 92 802 11a 54 Mbps 74 802 11n HT20 MCS0 ...

Страница 78: ... Maximally supports up to 3 5 piconets at the same time Support one SCO or eSCO connection The BR EDR channel bandwidth is 1 MHz and can accommodate 79 channels The BLE channel bandwidth is 2 MHz and can accommodate 40 channels Table 31 Bluetooth Data Rate and Version Reference specifications are listed below Bluetooth Radio Frequency TSS and TP Specification 1 2 2 0 2 0 EDR 2 1 2 1 EDR 3 0 3 0 HS...

Страница 79: ...le lists the Bluetooth transmitting and receiving performance of SC200R series module Table 32 Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2 DH5 3 DH5 Transmitting Power 10 0 10 0 9 9 Receiver Performance Packet Types DH5 2 DH5 3 DH5 Receiving Sensitivity 91 90 90 ...

Страница 80: ...th an embedded LNA the module provides greatly improved positioning accuracy 5 1 GNSS Performance The following table lists the GNSS performance of the module in conduction mode Table 33 GNSS Performance SC200R WF SC262R WF does not support GNSS Parameter Description Typ Unit Sensitivity Cold start 146 dBm Reacquisition 158 dBm Tracking 158 dBm TTFF Cold start 30 8 s Warm start 21 s Hot start 3 3 ...

Страница 81: ...signal lines and RF components far away from high speed circuits switch mode power supplies power inductors the clock circuit of single chip microcomputers etc For applications with harsh electromagnetic environment or high ESD protection requirements it is recommended to add ESD protective diodes for the antenna interface The junction capacitance of the diodes should be less than 0 5 pF Otherwise...

Страница 82: ... antenna interfaces is shown below Table 34 Pin Definition of Main Rx diversity Antenna Interfaces The operating frequencies of SC200R series modules are listed in the following tables 6 1 1 Operating Frequencies Table 35 SC200R CE Operating Frequencies Pin Name Pin No I O Description Comment ANT_MAIN 87 AIO Main antenna interface 50 Ω impedance ANT_DRX 131 AI Rx diversity antenna interface 3GPP B...

Страница 83: ...1880 1920 MHz LTE TDD B40 2300 2400 2300 2400 MHz LTE TDD B41 2535 2675 2535 2675 MHz 3GPP Band Receive Transmit Unit GSM850 869 894 824 849 MHz EGSM900 925 960 880 915 MHz DCS1800 1805 1880 1710 1785 MHz PCS1900 1930 1990 1850 1910 MHz WCDMA B1 2110 2170 1920 1980 MHz WCDMA B2 1930 1990 1850 1910 MHz WCDMA B4 2110 2155 1710 1755 MHz WCDMA B5 869 894 824 849 MHz WCDMA B8 925 960 880 915 MHz LTE FD...

Страница 84: ...00 MHz LTE TDD B41 2496 2690 2496 2690 MHz 3GPP Band Receive Transmit Unit WCDMA B2 1930 1990 1850 1910 MHz WCDMA B4 2110 2155 1710 1755 MHz WCDMA B5 869 894 824 849 MHz LTE FDD B2 1930 1990 1850 1910 MHz LTE FDD B4 2110 2155 1710 1755 MHz LTE FDD B5 869 894 824 849 MHz LTE FDD B7 2620 2690 2500 2570 MHz LTE FDD B12 729 746 699 716 MHz LTE FDD B13 746 756 777 787 MHz LTE FDD B14 758 768 788 798 MH...

Страница 85: ...acitors are not mounted by default and the resistors are 0 Ω LTE FDD B71 663 698 617 652 MHz LTE TDD B41 2496 2690 2496 2690 MHz 3GPP Band Receive Transmit Unit WCDMA B1 2110 2170 1920 1980 MHz WCDMA B6 875 885 830 840 MHz WCDMA B8 925 960 880 915 MHz WCDAM B19 875 890 830 845 MHz LTE FDD B1 2110 2170 1920 1980 MHz LTE FDD B3 1805 1880 1710 1785 MHz LTE FDD B5 869 894 824 849 MHz LTE FDD B8 925 96...

Страница 86: ...ooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi Fi Bluetooth antenna interface Table 39 Pin Definition of Wi Fi Bluetooth Antenna Interface Table 40 Wi Fi Bluetooth Frequency Pin Name Pin No I O Description Comment ANT_WIFI BT 77 AIO Wi Fi Bluetooth antenna interface 50 Ω impedance Type Frequency Unit Wi Fi 2 4 GHz 2402 2482 MHz Wi Fi 5 GHz...

Страница 87: ...t Design for Wi Fi Bluetooth Antenna 6 3 GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface Table 41 Pin Definition of GNSS Antenna Interface Table 42 GNSS Frequency SC200R WF SC262R WF does not support GNSS Pin Name Pin No I O Description Comment ANT_GNSS 121 AI GNSS antenna interface 50 Ω impedance Type Frequency Unit GPS 157...

Страница 88: ...s recommended to add an external LNA circuit for better GNSS receiving performance and place the LNA close to the antenna 6 3 2 Recommended Circuit for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna s signal path The common power supply voltage ranges from 3 3 V to 5 0 V Despite its low power consumption the active antenna still requires stable and clean power...

Страница 89: ...ace width W the materials dielectric constant the height from the reference ground to the signal layer H and the spacing between RF traces and grounds S Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance The following are reference designs of microstrip or coplanar waveguide with different PCB structures Figure 33 Microstrip Design on a 2 layer PCB ...

Страница 90: ... connect them to ground Keep the distance between the RF pins and the RF connector as short as possible Change all the right angle traces to curved ones and the recommended trace angle is 135 Reserve clearance under the signal pin of the antenna connector or solder joint Keep the reference ground of RF traces complete Meanwhile add some ground vias around RF traces and the reference ground to impr...

Страница 91: ... B8 B19 EVDO CDMA BC0 LTE FDD B5 B8 B12 B13 B14 B17 B18 B19 B20 B26 B28A B28B B71 Cable Insertion Loss 1 5 dB DCS1800 PCS1900 WCDMA B1 B2 B4 LTE B1 B2 B3 B4 B11 B21 B25 B34 B39 B66 Cable Insertion Loss 2 dB LTE FDD B7 LTE TDD B38 B40 B41 Wi Fi Bluetooth VSWR 2 2 4G HZ Gain 0 47 dBi Max Input Power 50 W Input Impedance 50 Ω Polarization Type Vertical Cable Insertion Loss 1 dB GNSS1 Frequency range ...

Страница 92: ...supported as the use of active antenna may generate harmonics which will affect the GNSS performance 6 5 2 Recommended RF Connector for Antenna Installation If you use an RF connector for antenna connection it is recommended to use the U FL R SMT connector provided by HIROSE Figure 37 Dimensions of the U FL R SMT Connector Unit mm NOTE ...

Страница 93: ...onnectors listed in the following figure can be used to match the U FL R SMT Figure 38 Mechanicals of U FL LP Connectors The following figure describes the space factor of mated connectors Figure 39 Space Factor of Mated Connectors Unit mm For more details visit http www hirose com ...

Страница 94: ...e following table Table 44 Absolute Maximum Ratings 7 2 Power Supply Ratings Table 45 Power Supply Ratings Parameter Min Max Unit VBAT 0 5 6 V USB_VBUS 0 5 16 V Peak Current of VBAT 0 3 A Voltage on Digital Pins 0 3 2 16 V Parameter Description Conditions Min Typ Max Unit VBAT VBAT The actual input voltages must stay between the minimum and maximum values 3 55 3 8 4 2 V Voltage drop during transmi...

Страница 95: ...ion The values of current consumption are shown below Table 47 SC200R CE Current Consumption IVBAT Peak supply current during transmission slot Maximum power control level at EGSM900 1 8 3 0 A USB_VBUS USB power supply 4 35 5 0 6 2 V VRTC Power supply voltage of the backup battery 2 0 3 0 3 25 V Parameter Min Typ Max Unit Operating temperature range 1 35 25 75 º C Storage Temperature Range 40 90 º...

Страница 96: ...0 mA LTE FDD supply current Sleep USB disconnected DRX 5 7 03 mA Sleep USB disconnected DRX 6 4 95 mA Sleep USB disconnected DRX 7 4 20 mA Sleep USB disconnected DRX 9 3 90 mA LTE TDD supply current Sleep USB disconnected DRX 5 6 78 mA Sleep USB disconnected DRX 6 5 11 mA Sleep USB disconnected DRX 7 4 34 mA Sleep USB disconnected DRX 9 3 93 mA GSM voice call EGSM900 PCL 5 255 7 mA EGSM900 PCL 12 ...

Страница 97: ...CL 8 305 6 mA EGSM900 3UL 2DL PCL 8 421 4 mA EGSM900 4UL 1DL PCL 8 562 5 mA DCS1800 1UL 4DL PCL 2 163 2 mA DCS1800 2UL 3DL PCL 2 274 4 mA DCS1800 3UL 2DL PCL 2 386 4 mA DCS1800 4UL 1DL PCL 2 465 5 mA WCDMA data transfer B1 HSDPA max power 551 4 mA B8 HSDPA max power 482 5 mA B1 HSUPA max power 583 4 mA B8 HSUPA max power 493 5 mA EVDO CDMA data transfer BC0 max power 526 0 mA LTE data transfer LTE...

Страница 98: ... DRX 5 2 9 mA Sleep USB disconnected DRX 9 2 6 mA WCDMA supply current Sleep USB disconnected DRX 6 4 1 mA Sleep USB disconnected DRX 8 3 1 mA Sleep USB disconnected DRX 9 2 8 mA LTE FDD supply current Sleep USB disconnected DRX 6 4 6 mA Sleep USB disconnected DRX 8 3 5 mA Sleep USB disconnected DRX 9 3 0 mA LTE TDD supply current Sleep USB disconnected DRX 6 4 7 mA Sleep USB disconnected DRX 8 3 ...

Страница 99: ...83 mA B4 max power 587 6 mA B5 max power 511 9 mA B8 max power 558 7 mA GPRS data transfer GSM850 1UL 4DL PCL 5 278 8 mA GSM850 2UL 3DL PCL 5 414 2 mA GSM850 3UL 2DL PCL 5 495 3 mA GSM850 4UL 1DL PCL 5 598 1 mA EGSM900 1UL 4DL PCL 5 262 4 mA EGSM900 2UL 3DL PCL 5 397 mA EGSM900 3UL 2DL PCL 5 469 3 mA EGSM900 4UL 1DL PCL 5 566 mA DCS1800 1UL 4DL PCL 0 195 5 mA DCS1800 2UL 3DL PCL 0 289 mA DCS1800 3...

Страница 100: ...EGSM900 2UL 3DL PCL 8 333 5 mA EGSM900 3UL 2DL PCL 8 454 2 mA EGSM900 4UL 1DL PCL 8 578 9 mA DCS1800 1UL 4DL PCL 2 197 3 mA DCS1800 2UL 3DL PCL 2 304 5 mA DCS1800 3UL 2DL PCL 2 393 4 mA DCS1800 4UL 1DL PCL 2 495 1 mA PCS1900 1UL 4DL PCL 2 184 7 mA PCS1900 2UL 3DL PCL 2 292 2 mA PCS1900 3UL 2DL PCL 2 393 4 mA PCS1900 4UL 1DL PCL 2 496 2 mA WCDMA data transfer B1 HSDPA max power 511 3 mA B2 HSDPA ma...

Страница 101: ...758 7 mA LTE FDD B5 max power 615 5 mA LTE FDD B7 max power 826 9 mA LTE FDD B8 max power 642 7 mA LTE FDD B20 max power 677 9 mA LTE FDD B28 max power 764 5 mA LTE TDD B38 max power 448 4 mA LTE TDD B40 max power 432 7 mA LTE TDD B41 max power 444 2 mA Description Conditions Typ Unit OFF state Power down 8 μA WCDMA supply current Sleep USB disconnected DRX 6 3 698 mA Sleep USB disconnected DRX 8 ...

Страница 102: ...HSDPA max power 617 1 mA B4 HSDPA max power 608 5 mA B5 HSDPA max power 541 7 mA B2 HSUPA max power 631 8 mA B4 HSUPA max power 608 8 mA B5 HSUPA max power 553 3 mA LTE data transfer LTE FDD B2 max power 729 9 mA LTE FDD B4 max power 727 8 mA LTE FDD B5 max power 581 1 mA LTE FDD B7 max power 850 7 mA LTE FDD B12 max power 734 9 mA LTE FDD B13 max power 721 7 mA LTE FDD B14 max power 700 mA LTE FD...

Страница 103: ...rent Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 8 TBD mA Sleep USB disconnected DRX 9 TBD mA LTE TDD supply current Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 8 TBD mA Sleep USB disconnected DRX 9 TBD mA WCDMA voice call B1 max power TBD mA B6 max power TBD mA B8 max power TBD mA B19 max power TBD mA WCDMA data transfer B1 HSDPA max power TBD mA B6 HSDPA max...

Страница 104: ...LTE FDD B5 max power TBD mA LTE FDD B8 max power TBD mA LTE FDD B11 max power TBD mA LTE FDD B18 max power TBD mA LTE FDD B19 max power TBD mA LTE FDD B21 max power TBD mA LTE FDD B26 max power TBD mA LTE FDD B28 max power TBD mA LTE TDD B41 max power TBD mA Frequency Max Min EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800 30 dBm 2 dB 0 dBm 5 dB WCDMA B1 24 dBm 1 3 dB 49 dBm WCDMA B8 24 dBm 1 3 dB 49 dBm E...

Страница 105: ...B41 23 dBm 2 dB 39 dBm Frequency Max Min GSM850 33 dBm 2 dB 5 dBm 5 dB EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800 30 dBm 2 dB 0 dBm 5 dB PCS1900 30 dBm 2 dB 0 dBm 5 dB WCDMA B1 24 dBm 1 3 dB 49 dBm WCDMA B2 24 dBm 1 3 dB 49 dBm WCDMA B4 24 dBm 1 3 dB 49 dBm WCDMA B5 24 dBm 1 3 dB 49 dBm WCDMA B8 24 dBm 1 3 dB 49 dBm LTE FDD B1 23 dBm 2 dB 39 dBm LTE FDD B2 23 dBm 2 dB 39 dBm LTE FDD B3 23 dBm 2 dB 39 ...

Страница 106: ...Max Min WCDMA B2 24 dBm 1 3 dB 49 dBm WCDMA B4 24 dBm 1 3 dB 49 dBm WCDMA B5 24 dBm 1 3 dB 49 dBm LTE FDD B2 23 dBm 2 dB 39 dBm LTE FDD B4 23 dBm 2 dB 39 dBm LTE FDD B5 23 dBm 2 dB 39 dBm LTE FDD B7 23 dBm 2 dB 39 dBm LTE FDD B12 23 dBm 2 dB 39 dBm LTE FDD B13 23 dBm 2 dB 39 dBm LTE FDD B14 23 dBm 2 dB 39 dBm LTE FDD B17 23 dBm 2 dB 39 dBm LTE FDD B25 23 dBm 2 dB 39 dBm LTE FDD B26 23 dBm 2 dB 39 ...

Страница 107: ... 16 of 3GPP TS 51 010 1 7 6 RF Receiving Sensitivity The following table shows the RF receiving sensitivity of SC200R series modules Frequency Max Min WCDMA B1 TBD TBD WCDMA B6 TBD TBD WCDMA B8 TBD TBD WCDMA B19 TBD TBD LTE FDD B1 TBD TBD LTE FDD B3 TBD TBD LTE FDD B5 TBD TBD LTE FDD B8 TBD TBD LTE FDD B11 TBD TBD LTE FDD B18 TBD TBD LTE FDD B19 TBD TBD LTE FDD B21 TBD TBD LTE FDD B26 TBD TBD LTE ...

Страница 108: ...104 dBm LTE FDD B1 10 MHz 97 6 99 101 2 96 3 dBm LTE FDD B3 10 MHz 97 2 96 99 2 93 3 dBm LTE FDD B5 10 MHz 99 2 100 102 8 94 3 dBm LTE FDD B8 10 MHz 97 9 100 3 102 2 93 3 dBm LTE TDD B34 10 MHz 98 2 98 3 100 5 96 3 dBm LTE TDD B38 10 MHz 98 0 98 0 100 5 96 3 dBm LTE TDD B39 10 MHz 98 3 99 101 2 96 3 dBm LTE TDD B40 10 MHz 98 7 98 101 3 96 3 dBm LTE TDD B41 10 MHz 97 2 97 9 99 2 94 3 dBm Frequency ...

Страница 109: ...3 3 dBm LTE FDD B4 10 MHz 98 2 99 5 101 5 96 3 dBm LTE FDD B5 10 MHz 100 100 5 101 5 94 3 dBm LTE FDD B7 10 MHz 97 3 97 5 100 94 3 dBm LTE FDD B8 10 MHz 99 5 100 102 5 93 3 dBm LTE FDD B20 10 MHz 99 5 100 2 102 5 93 3 dBm LTE FDD B28 10 MHz 98 3 99 5 101 5 94 8 dBm LTE TDD B38 10 MHz 98 98 100 5 96 3 dBm LTE TDD B40 10 MHz 99 99 101 5 96 3 dBm LTE TDD B41 10 MHz 97 3 97 2 99 5 94 3 dBm Frequency R...

Страница 110: ...Bm LTE FDD B25 10 MHz 98 4 99 3 101 6 92 8 dBm LTE FDD B26 10 MHz 99 8 100 8 103 6 93 8 dBm LTE FDD B66 10 MHz 98 5 99 101 5 96 3 dBm LTE FDD B71 10 MHz 97 8 97 6 100 8 93 5 dBm LTE TDD B41 10 MHz 98 1 97 8 100 8 94 3 dBm Frequency Receiving Sensitivity Typ 3GPP SIMO Primary Diversity SIMO WCDMA B1 TBD TBD TBD 102 4 dBm WCDMA B6 TBD TBD TBD 102 4 dBm WCDMA B8 TBD TBD TBD 106 7 dBm WCDAM B19 TBD TB...

Страница 111: ... and operation of any application that incorporates the module The following table shows the electrostatic discharge characteristics of SC200R series module Table 59 ESD Characteristics Temperature 25 º C Humidity 45 LTE FDD B18 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B19 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B21 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B26 10 MHz TBD TBD TBD 93 8 dBm LTE FDD B28 10 MHz TBD ...

Страница 112: ...nsions This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the tolerances for dimensions without tolerance values are 0 2 mm 8 1 Mechanical Dimensions of the Module Figure 40 Top and Side Dimensions Pin 1 Top view Side view ...

Страница 113: ...Smart Module Series SC200R SC262R_Series_Hardware_Design 112 124 Figure 41 Bottom Dimensions Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE ...

Страница 114: ...24 8 2 Recommended Footprint Figure 42 Recommended Footprint Top View 1 For easy maintenance of the module keep at least 5 mm between the module and other components on the host PCB 2 All RESERVED pins should be kept open and MUST NOT be connected to ground NOTES ...

Страница 115: ... 124 8 3 Top and Bottom Views of the Module Figure 43 Top and Bottom Views of the Module Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label please refer to the module received from Quectel NOTE ...

Страница 116: ...le must be processed in reflow soldering or other high temperature operations within 168 hours Otherwise the module should be stored in an environment where the relative humidity is less than 10 e g a drying cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Conditio...

Страница 117: ...esired see IPC JEDEC J STD 033 for the baking procedure 4 Pay attention to ESD protection such as wearing anti static gloves when touching the modules 9 2 Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil thus making the paste fill the stencil openings and then penetrate to the PCB The force on the squeegee should be adjusted properly so as to produc...

Страница 118: ...x slope 2 3 C s Figure 44 Recommended Reflow Soldering Thermal Profile Table 60 Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1 3 C s Soak time between A and B 150 C and 200 C 70 120 s Reflow Zone Max slope 2 3 C s Reflow time D over 217 C 40 70 s Max temperature 235 C to 246 C Cooling down slope 1 5 to 3 C s Reflow Cycle Max reflow cycle 1 ...

Страница 119: ...ent the coating material from flowing into the module 9 3 Packaging SC200R series module is packaged in tape and reel carriers and sealed in the vacuum sealed bag It is not recommended to open the vacuum package before using the module for actual production Each reel is 380 mm in diameter and contains 200 modules The following figures show the package details measured in mm Figure 45 Tape Dimensio...

Страница 120: ...n 119 124 Figure 46 Reel Dimensions Unit mm Table 61 Reel Packaging Model Name MOQ for MP Minimum Package 200 pcs Minimum Package 4 800 pcs SC200R series 200 pcs Size 405 mm 390 mm 83 mm N W 1 9 kg G W 3 7 kg Size 425 mm 358 mm 410 mm N W 7 6 kg G W 15 2 kg ...

Страница 121: ...in Description and GPIO Configuration 3 Quectel_RF_Layout_Application_Note RF Layout Application Note 4 Quectel_Module_Secondary_SMT_Application _Note Module Secondary SMT Application Note 5 Quectel_SC200R_Series_Reference_Design SC200R Series Reference Design Abbreviation Description ADC Analog to Digital Converter ADSP Audio Digital Signal Processor ALS Ambient Light Sensor AMR Adaptive Multi ra...

Страница 122: ...rrier DCS Digital Cellular System DL Downlink DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying DRX Discontinuous Reception DSI Display Serial Interface DSP Digital Signal Processor ECM Electret Condenser Microphone EDGE Enhanced Data Rate for GSM Evolution EDR Enhanced Data Rate EFR Enhanced Full Rate EGSM Extended GSM eMMC Embedded Multimedia Card eS...

Страница 123: ...Frequency Shift Keying GLONASS Global Navigation Satellite System Russia GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GPU Graphics Processing Unit GRFC Generic RF control GSM Global System for Mobile Communications G W Gross Weight HD High Definition Plus HR Half Rate HS ...

Страница 124: ...tions for the year 2000 IOmax Maximum Output Load Current LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LPDDR Low Power Double Data Rate LTE Long Term Evolution M2M Machine to Machine MAC Media Access Control MCS Modulation and Coding Scheme MEMS Micro Electro Mechanic...

Страница 125: ...P One Time Programable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication Service PDA Personal Digital Assistant PDU Protocol Data Unit PHY Physical Layer PMU Power Management Unit POS Point of Sale PS Proximity Sensor PWM Pulse Width Modulation PSK Phase Shift Keying QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift K...

Страница 126: ...evice SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface STA Station TDD Time Division Duplex TP Touch Panel TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver Transmitter UL Uplink UMTS Universal Mobile Telecommunications System USB Universal Serial Bus U SIM Universal Subscriber Identity Module VBAT Voltage at Battery ...

Страница 127: ... Voltage Value VO Voltage Output VOmax Maximum Output Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value WAPI WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network XO Crystal Oscillator ...

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