5G Module Series
RM510Q-GL Hardware Design
RM510Q-GL_Hardware_Design 80 / 88
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate) for a long time, it is strongly recommended to add a thermal pad or other thermally
conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown as below, and
conductive compounds are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips inside the module.
The dimensions are measured in mm.
Figure 38: Thermal Dissipation Area on Bottom Side of Module
There are other measures to enhance heat dissipation performance:
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Add ground vias as many as possible on PCB.
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Maximize airflow over/around the module.
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Place the module away from other heating sources.
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Module mounting holes must be used to attach (ground) the device to the main PCB ground.
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It is NOT recommended to apply solder mask on the main PCB where the module’s thermal
dissipation area is located.
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Select appropriate material, thickness and surface for the outer housing of the application device that
integrates the module (i.e. the mechanical enclosure) to enhance thermal dissipation ability.
Customers may also need active cooling to dissipate heat of the module.
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If possible, add a heatsink on the top of the module. A thermal pad should be used between the