5G Module Series
RM502Q-GL Hardware Design
RM502Q-GL_Hardware_Design 33 / 77
Please note that only USB 2.0 can be used for firmware upgrade currently.
The following table shows the pin definition of USB interface.
Table 9: Pin Definition of USB Interface
“*” means under development.
For more details about the USB 3.1 & 2.0 specifications, please visit http://www.usb.org/home.
The USB 2.0 interface is recommended to be reserved for firmware upgrade in designs. The following
figure shows a reference circuit of USB 3.1 & 2.0 interface.
Host
Module
USB_DM
USB_DP
USB_SS_RX_P
USB_SS_RX_M
USB_SS_TX_P
USB_SS_TX_M
BB
USB_DM
USB_DP
USB_SS_RX_P
USB_SS_RX_M
USB_SS_TX_P
USB_SS_TX_M
9
7
37
35
31
29
ESD
Test Points
Minimize these stubs in PCB layout.
C5 220nF
C6 220nF
C1 220nF
C2 220nF
R1 0
Ω
R2 0
Ω
R3 NM-0
Ω
R4 NM-0
Ω
Figure 20: Reference Circuit of USB 3.1 & 2.0 Interface
Pin No. Pin Name
I/O
Description
Comment
7
USB_DP
AI/AO
USB 2.0 differential data bus (+)
Require differential
impedance of 90
Ω
9
USB_DM
AI/AO
USB 2.0 differential data bus (-)
29
USB_SS_TX_M
AO
USB 3.1 transmit data (-)
Require differential
impedance of 90
Ω
31
USB_SS_TX_P
AO
USB 3.1 transmit data (+)
35
USB_SS_RX_M
AI
USB 3.1 receive data (-)
Require differential
impedance of 90
Ω
37
USB_SS_RX_P
AI
USB 3.1 receive data (+)
NOTE