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LTE-A Module Series
EG18 Hardware Design
EG18_Hardware_Design 90 / 104
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following figures manifest two kinds of heatsink designs for reference. Please choose one or both of
them according to particular application structure.
Heatsink
EG18 Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 45: Reference Design of Heatsink (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG18 Module
Shielding Cover
Figure 46: Reference Design of Heatsink (Heatsink at the Backside of PCB)