LTE-A Module Series
EG18 Hardware Design
EG18_Hardware_Design 24 / 104
For 3.0V (U)SIM:
V
OL
max=0.4V
V
OH
min=2.3V
USB Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics Comment
USB_VBUS
32
DI
USB connection
detection
Vmax=5.25V
Vmin=3.3V
Vnorm=5.0V
USB_DM
33
IO
USB 2.0 differential
data bus (-)
Comply with USB
2.0 standard
specifications.
Require differential
impedance of 90Ω.
USB_DP
34
IO
USB 2.0 differential
data bus (+)
USB_SS_ TX_M 37
AO
USB 3.0 super speed
transmission (-)
Comply with USB
3.0 standard
specifications.
Require differential
impedance of 90Ω.
USB_SS_ TX_P
38
AO
USB 3.0 super speed
transmission (+)
USB_SS_ RX_P
40
AI
USB 3.0 super speed
receiving (+)
USB_SS_ RX_M 41
AI
USB 3.0 super speed
receiving (-)
USB_ID
36
DI
OTG identification
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
OTG_PWR_EN
143
DO
OTG power control
V
OL
max=0.45V
V
OH
min=1.35V
SDIO Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics Comment
SD_VDD
46
PO
SD card application
:
SDIO pull up power
source
eMMC application
:
Keep it open when
used for eMMC
For 1.8V SD card:
Vmax=1.9V
Vmin=1.75V
For 3.0V SD card:
Vmax=3.05V
Vmin=2.75V
I
O
max=50mA
Either 1.8V or 3.0V
is supported by the
module
automatically.
Power of SD card
must be provided by
an external power
supply.
SD_DATA0
49
IO
SDIO data signal (bit
0)
For 1.8V SD card:
V
OL
max=0.45V
V
OH
min=1.4V
If unused, keep it
open.
SD_DATA1
50
IO
SDIO data signal (bit
If unused, keep it