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Wi-Fi&Bluetooth Module Series

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Storage, Manufacturing & Packaging

7.1. Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage

requirements are shown below.

1. Recommended Storage Condition: The temperature shall be 23 ±5 °C and the relative humidity shall

be 35

–60 %.

2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.

3. The floor life of the module is 168 hours 4 in a plant where the temperature is 23 ±5 °C and relative

humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be

processed in reflow soldering or other high-temperature operations within 24 hours. Otherwise, the

module shall be stored in an environment where the relative humidity is less than 10 % (e.g. a drying

cabinet).

4. The module shall be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the

following circumstances:



The module is not stored in Recommended Storage Condition;



Violation of the third requirement above occurs;



Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;



Before module repairing.

5. If needed, the pre-baking shall follow the requirements below:



The module shall be baked for 8 hours at 120 ±5 °C;



All modules must be soldered to PCB within 24 hours after the baking, otherwise they shall be put

in a dry environment such as in a drying oven.

This floor life is only applicable when the environment conforms to

IPC/JEDEC J-STD-033

. It is recommended to start the

solder reflow process within 24 hours

after the package is removed if the temperature and moisture do not conform to, or

are not sure to conform to

IPC/JEDEC J-STD-033

. And do not remove the packages of tremendous modules if they are not

ready for soldering.

Содержание FC909A

Страница 1: ...FC909A Hardware Design Wi Fi Bluetooth Module Series Version 1 0 0 Date 2022 01 13 Status Preliminary ...

Страница 2: ...cially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis We may revise or restate this document from time to time at our sole discretion without any prior notice to you Copyright Our and third party products hereunder may contain copyrighted material Such copyrig...

Страница 3: ...iers or customer designated servers Quectel strictly abiding by the relevant laws and regulations shall retain use disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws Before data interaction with third parties please be informed of their privacy and data security policy Disclaimer a We acknowledge no liability for any injury...

Страница 4: ...e interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions such as when the mobile bill is unpaid or the U SIM card is invalid When emergency help is nee...

Страница 5: ...Fi Bluetooth Module Series FC909A_Hardware_Design 4 49 About the Document Revision History Version Date Author Description 2022 01 13 Macky XU Creation of the document 1 0 0 2022 01 13 Macky XU Preliminary ...

Страница 6: ...ns 20 3 3 2 Buck Circuit Pins 21 3 4 WLAN Application Interfaces 22 3 4 1 SDIO Interface 22 3 4 2 WLAN_EN 24 3 4 3 WLAN_WAKE 24 3 4 4 Introduction of WLAN Pin Multiplexing Function 26 3 5 Bluetooth Application Interfaces 27 3 5 1 UART 27 3 5 2 BT_EN 28 3 5 3 BT_WAKE_HOST and HOST_WAKE_BT 29 3 5 4 PCM Interface 29 3 6 Other Interfaces 30 3 6 1 WLAN_SLP_CLK 30 3 6 2 XTAL_IN OUT 30 3 6 3 GPIOs 31 4 R...

Страница 7: ...5 4 RF Performance 40 5 4 1 Wi Fi Performance 40 5 4 2 BLE Performance 41 5 5 ESD Protection 41 6 Mechanical Information 42 6 1 Mechanical Dimensions 42 6 2 Recommended Footprint 44 6 3 Top and Bottom Views 45 7 Storage Manufacturing Packaging 46 7 1 Storage Conditions 46 7 2 Manufacturing and Soldering 47 7 3 Packaging Specifications 49 7 3 1 Carrier Tape 49 7 3 2 Plastic Reel 49 7 3 3 Packaging ...

Страница 8: ...30 Table 19 XTAL_IN OUT Parameter Definition 31 Table 20 Pin Definition of GPIOs 31 Table 21 Pin Definition of RF Antenna Interfaces 32 Table 22 FC909A Operating Frequency 32 Table 23 Antenna Cable Requirements 35 Table 24 Antenna requirements 35 Table 25 Absolute Maximum Ratings 38 Table 26 Recommended Operating Conditions 38 Table 27 General DC Electrical Characteristics for 1 8 V Domain 39 Tabl...

Страница 9: ... layer PCB 33 Figure 11 Coplanar Waveguide Design on a 2 layer PCB 34 Figure 12 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground 34 Figure 13 Coplanar Waveguide Design on a 4 layer PCB Layer 4 as Reference Ground 34 Figure 14 Dimensions of the U FL R SMT Connector Unit mm 36 Figure 15 Mechanicals of U FL LP Connectors 36 Figure 16 Space Factor of Mated Connector Unit mm 37 Fi...

Страница 10: ...rence by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help This device complies with FCC radiation exposure limits set forth for an uncontr...

Страница 11: ... FCC ID can be used only when all FCC compliance requirements are met Antenna Installation 1 The antenna must be installed such that 20 cm is maintained between the antenna and users 2 The transmitter module may not be co located with any other transmitter or antenna 3 Only antennas of the same type and with equal or less gains as shown below may be used with this module Other types of antennas an...

Страница 12: ...roduct for any additional compliance requirements required with this module installed Cet appareil est conç u uniquement pour les inté grateurs OEM dans les conditions suivantes Pour utilisation de dispositif module 1 L antenne doit ê tre installé e de telle sorte qu une distance de 20 cm est respecté e entre l antenne et les utilisateurs et 2 Le module é metteur peut ne pas ê tre coï mplantéavec ...

Страница 13: ...doit être étiqueté dans un endroit visible avec l inscription suivante Contient des IC 10224A 2022FC909A Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user s manual of the end product which integrates this module The end user manual shall include all required regulatory infor...

Страница 14: ...wise specified when an asterisk is used after a function feature interface pin name AT command or argument it indicates that the function feature interface pin AT command or argument is under development and currently not supported and the asterisk after a model indicates that the sample of such model is currently unavailable ...

Страница 15: ...PCM interface for Bluetooth FC909A can provide WLAN and Bluetooth functions 2 2 Key Features The following table describes the key features of FC909A Table 2 Key Features Features Details Power Supply VBAT power supply Supply voltage range 3 0 4 8 V Typical voltage supply 3 6 V VDDIO power supply Supply voltage range 1 71 3 63 V Typical voltage supply 1 8 3 3 V Module buck s typical voltage VIN_LD...

Страница 16: ...Mode AP STA Wi Fi Modulation DSSS OFDM DBPSK DQPSK CCK BPSK QPSK 16QAM 64QAM WLAN Application Interface SDIO 2 0 Bluetooth Application Interface UART and PCM RF Antenna Interfaces ANT_WIFI0 BT 50 Ω impedance Physical Characteristics Size 12 0 0 15 mm 12 0 0 15 mm 1 95 0 2 mm Package LCC Weight TBD Temperature Range Operating temperature range 30 C to 85 C 1 Storage temperature range 40 C to 85 C R...

Страница 17: ...ystal or external crystal 2 3 EVB To help customers to develop applications with FC909A the evaluation board tools include EVB board FC909A M 2 and corresponding TE A USB 2 0 data cable antenna and other external devices used to control and test the module For details see document 1 NOTE ...

Страница 18: ...nction pins and interfaces of the module Power supply WLAN application interfaces Bluetooth application interfaces RF antenna interfaces Other interfaces WLAN_SLP_CLK XTAL_IN OUT GPIOs 3 2 Pin Description The following tables show the pin description of FC909A Table 3 I O Parameters Definition Type Description AIO Analog Input Output DI Digital Input DO Digital Output DIO Digital Input Output PI P...

Страница 19: ...or the module GND 1 3 20 31 33 36 WLAN Application Interface Pin Name Pin No I O Description Comment WLAN_EN 12 DI WLAN function enable control VDDIO power domain Active high WLAN_WAKE 13 DO Wake up the host by WLAN VDDIO power domain SDIO_DATA2 2 14 DIO SDIO data bit 2 NC VDDIO power domain Supports 1 bit or 4 bit mode SDIO_DATA3 15 DIO SDIO data bit 3 NC SDIO_CMD 16 DIO SDIO command SDIO_CLK 17 ...

Страница 20: ... request to send BT_TXD 42 DO Bluetooth UART transmit BT_RXD 43 DI Bluetooth UART receive BT_CTS 44 DI Bluetooth UART clear to send RF Antenna Interfaces Pin Name Pin No I O Description Comment ANT_WIFI0 BT 2 AIO Wi Fi0 Bluetooth antenna interface 50 Ω impedance Other Interfaces Pin Name Pin No I O Description Comment WLAN_SLP_CLK 24 DI External 32 768 kHz low power clock input XTAL_IN 10 DI Cryst...

Страница 21: ...llel 100 μF decoupling capacitors and 1 μF and 100 nF filter capacitors near the input of the module s VBAT Meanwhile it is recommended to add a TVS near the VBAT input terminal to prevent surge voltage In principle the longer the VBAT traces the wider the traces When paired with LTE modules it is recommended to use 10 pF and 33 pF for C2 C4 FC909A VBAT VBAT D1 C2 C3 C4 NM C1 100 μF 1 μF 100 nF R1...

Страница 22: ...ed GND pin of the buck circuit Because the buck circuit is prone to high frequency noise so please pay attention to it It is recommended to use 2 2 μH inductors such as TFM201610ALM 2R2MTAA TDK and 4 7 μF capacitors to ensure that the traces are as short as possible and the trace width shall not be less than 0 4 mm At the same time it is recommended to route the traces away from sensitive signals ...

Страница 23: ...rfaces connection between FC909A and the host Host FC909A SDIO WLAN_EN WLAN_EN WLAN_WAKE WLAN_WAKE SDIO Figure 4 WLAN Application Interfaces Connection 3 4 1 SDIO Interface FC909A is used for SDIO 2 0 interface supports 1 bit mode or 4 bit mode automatic detection when SDIO link SDIO interface definition is as follows Parameter Recommend Unit Inductance 2 2 μH Tolerance 20 DCR 0 2 Ω Rated current ...

Страница 24: ...TA1 SDIO_DATA2 SDIO_DATA3 Host FC909A SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 SDIO_CLK SDIO_CMD 10K VDDIO NM_10K NM_10K NM_10K NM_10K NM NM NM NM NM NM NM_10K Pin Name Pin No 1 bit Mode 4 bit Mode SDIO_DATA2 14 NC SDIO data bit 2 SDIO_DATA3 15 NC SDIO data bit 3 SDIO_CMD 16 SDIO command SDIO command SDIO_CLK 17 SDIO clock SDIO clock SDIO_DATA0 18 SDIO data bit 0 SDIO data bit 0 SDIO_DATA1 19 I...

Страница 25: ...ed to be treated with equal length the distance between the traces is less than 1 mm The distance between SDIO signals and other signals must be greater than 2 times the trace width and the busload capacitance must be less than 15 pF The maximum length of the internal wiring of the SDIO interface is 5 71 mm 3 4 2 WLAN_EN WLAN_EN is used to control the WLAN function of the module Wi Fi function wil...

Страница 26: ...uetooth Module Series FC909A_Hardware_Design 25 49 Table 10 Pin Definition of WLAN_WAKE Pin Name Pin No I O Description Comment WLAN_WAKE 13 DO Wake up the host by WLAN VDDIO power domain If unused keep it open ...

Страница 27: ...e table above SDIO and SPI modes can be configured through SDIO_DATA2 Table 12 Pin Definition of SDIO Interface SDIO_DATA2 Mode Note L SPI Sampling at power on reset H SDIO Pin Name Pin No SPI Mode Description SDIO_DATA2 14 NC SDIO_DATA3 15 CS Card select SDIO_CMD 16 DI Data input SDIO_CLK 17 SCLK Clock SDIO_DATA0 18 DO Data output SDIO_DATA1 19 IRQ Interrupt ...

Страница 28: ... of Bluetooth Application Interfaces Connection 3 5 1 UART FC909A supports an HCI UART as defined in Bluetooth Core Specification Version 5 1 The UART supports hardware flow control and it is used for data transmission with the host It supports up to 4 0 Mbps baud rates Table 13 Pin Definition of UART Pin Name Pin No I O Description Comment BT_RTS 41 DO Bluetooth UART request to send VDDIO power d...

Страница 29: ...909A UART_RXD UART_TXD UART_CTS UART_RTS Host Figure 7 Reference Design for UART Connection When paired with Quectel s LTE modules it may be their own CTS connected to CTS and RTS connected to RTS This depends on the input and output directions so in principle when connected the input shall corresponds to the output 3 5 2 BT_EN BT_EN is used to control the Bluetooth function of FC909A Bluetooth fu...

Страница 30: ...n Definition of PCM Interface The following figure shows the PCM interface connection between FC909A and the host FC909A Host PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN PCM_CLK PCM_SYNC PCM_DIN PCM_DOUT Figure 8 PCM Interface Connection Pin Name Pin No I O Description Comment HOST_WAKE_BT 6 DI Host wakes up Bluetooth function VDDIO power domain BT_WAKE_HOST 7 DO Bluetooth function wakes up host Pin Name Pi...

Страница 31: ...he XTAL_IN and XTAL_OUT are external crystal pins and the recommended crystal frequency is 26 MHz These pins are optional and the crystal position has been reserved inside the module The following table is the recommended crystal parameters It is recommended that customers select the crystal according to the following table and based on their actual needs Pin Name Pin No I O Description WLAN_SLP_C...

Страница 32: ...AG mode If you need please contact Quectel Technical Supports Table 20 Pin Definition of GPIOs Parameter Min Typ Max Unit Frequency 26 MHz load capacitance 12 pF ESR 60 Ω Drive level 200 μW Frequency tolerance Initial over temperature 20 20 ppm Pin Name Pin No I O Description Comment GPIO1 40 DIO General purpose input output VDDIO power domain GPIO2 39 DIO General purpose input output ...

Страница 33: ...a pin shall be microstrip line or other types of RF trace with characteristic impendence close to 50 Ω FC909A comes with grounding pins which are next to the antenna pin in order to give a better grounding A reference circuit for the RF antenna interface is shown below It is recommended to reserve a LC and Π type matching circuit for better RF performance and it is also recommended to reserve an E...

Страница 34: ...aracteristic impedance of all RF traces shall be controlled to 50 Ω The impedance of the RF traces is usually determined by the trace width W the materials dielectric constant the height from the reference ground to the signal layer H and the spacing between RF traces and grounds S Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance The following are...

Страница 35: ...d Figure 13 Coplanar Waveguide Design on a 4 layer PCB Layer 4 as Reference Ground To ensure RF performance and reliability the following principles shall be complied with RF layout design Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω The GND pins adjacent to RF pins should not be designed as thermal relief pads and should be fully ...

Страница 36: ...formance The distance between the ground vias and RF traces should be more than two times the width of RF signal traces 2 W Keep RF traces away from interference sources and avoid intersection and paralleling between traces on adjacent layers For more details about RF layout see document 2 4 3 Requirements for Antenna Design The following table shows the requirements on RF antenna Table 23 Antenna...

Страница 37: ...nnector is used for antenna connection it is recommended to use the U FL R SMT connector provided by HIROSE Figure 14 Dimensions of the U FL R SMT Connector Unit mm U FL LP serial connectors listed in the following figure can be used to match the U FL R SMT Figure 15 Mechanicals of U FL LP Connectors ...

Страница 38: ...oth Module Series FC909A_Hardware_Design 37 49 The following figure describes the space factor of mated connector Figure 16 Space Factor of Mated Connector Unit mm For more details please visit https www hirose com ...

Страница 39: ...oltage on digital and analog pins of the module are listed in the following table Table 25 Absolute Maximum Ratings The following table shows the recommended operating conditions of the module Table 26 Recommended Operating Conditions Parameter Min Max Unit VBAT 0 3 5 5 V Digital I O Input Voltage 0 3 3 9 V Parameter Min Typ Max Unit VBAT 3 0 3 6 4 8 V VDDIO 1 71 1 8 3 3 3 63 V ...

Страница 40: ...Table 29 Current Consumption of the Module Normal Operation Symbol Parameter Min Max Unit VIH High level Input Voltage 0 65 VDDIO V VIL Low level Input Voltage 0 35 VDDIO V VOH High level Output Voltage VDDIO 0 45 V VOL Low level Output Voltage 0 45 V Symbol Parameter Min Max Unit VIH High level Input Voltage 2 V VIL Low level Input Voltage 0 8 V VOH High level Output Voltage VDDIO 0 4 V VOL Low l...

Страница 41: ...ensitivity at 2 4 GHz Wi Fi TX 54 Mbps 15 dBm 200 0 6 mA 802 11n HT20 TX MCS0 14 dBm 260 0 6 mA TX MCS7 14 dBm 190 0 6 mA Description Min Typ Unit 802 11b 1 Mbps 15 8 16 dBm 802 11b 11 Mbps 15 9 16 dBm 802 11g 6 Mbps 15 3 15 dBm 802 11g 54 Mbps 15 2 15 dBm 802 11n HT20 MCS0 14 4 14 dBm 802 11n HT20 MCS7 14 2 14 dBm Description Receiving Sensitivity Typ Unit 802 11b 1 Mbps 94 dBm 802 11b 11 Mbps 87...

Страница 42: ...that incorporates the module for example ESD protection should be added at the interface of circuit design and the points that are vulnerable to electrostatic discharge damage or influence anti static gloves should be worn during production etc ESD characteristics of the module s pins are as follows Table 33 Electrostatic Discharge Characteristics 25 º C 45 Relative Humidity 802 11n HT20 MCS7 71 d...

Страница 43: ... Mechanical Information This chapter describes the mechanical dimensions of FC905A All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unless otherwise specified 6 1 Mechanical Dimensions Figure 17 Top and Side Dimensions Pin 1 ...

Страница 44: ...Wi Fi Bluetooth Module Series FC909A_Hardware_Design 43 49 Figure 18 Bottom Dimension The package warpage level of the module conforms to JEITA ED 7306 standard NOTE Pin 1 ...

Страница 45: ...909A_Hardware_Design 44 49 6 2 Recommended Footprint Figure 19 Recommended Footprint Top View Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience NOTE ...

Страница 46: ..._Design 45 49 6 3 Top and Bottom Views Figure 20 Top and Bottom Views of FC909A Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label refer to the module received from Quectel NOTE ...

Страница 47: ...han 10 e g a drying cabinet 4 The module shall be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Condition Violation of the third requirement above occurs Vacuum sealed packaging is broken or the packaging has been removed for over 24 hours Before module repairing 5 If needed the pre baking sh...

Страница 48: ...l the stencil openings and then penetrate to the PCB The force on the squeegee shall be adjusted properly to produce a clean stencil surface on a single pass To ensure the module soldering quality the thickness of stencil for the module is recommended to be 0 15 0 18mm For more details see document 3 The peak reflow temperature shall be 235 246 º C with 246 º C as the absolute maximum reflow tempe...

Страница 49: ...although white rust may be found 3 If a conformal coating is necessary for the module do NOT use any coating material that may chemically react with the PCB or shielding cover and prevent the coating material from flowing into the module 4 Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module 5 Due to the complexity of the SMT process please contact Q...

Страница 50: ...carrier tape packaging and details are as follow 7 3 1 Carrier Tape Dimension details are as follow Figure 22 Carrier Tape Dimension Drawing Table 35 Carrier Tape Dimension Table Unit mm 7 3 2 Plastic Reel Figure 23 Plastic Reel Dimension Drawing W P T A0 B0 K0 K1 F E 24 16 0 35 12 4 12 4 2 6 3 6 11 5 1 75 ...

Страница 51: ...heat sealed carrier tape to the plastic reel and use the protective tape for protection 1 plastic reel can load 500 modules Place the packaged plastic reel humidity indicator card and desiccant bag into a vacuum bag vacuumize it Place the vacuum packed plastic reel into the pizza box Put 4 packaged pizza boxes into 1 carton and seal it 1 carton can pack 2000 modules Figure 24 Packaging Process øD1...

Страница 52: ...Application_Note 3 Quectel_Module_Secondary_SMT_Application_Note Abbreviation Description AP Access Point BLE Bluetooth Low Energy BPSK Binary Phase Shift Keying BT Bluetooth CCK Complementary Code Keying CTS Clear To Send DQPSK Differential Quadrature Reference Phase Shift Keying GATT Generic Attribute Profile GND Ground HT High Throughput IEEE Institute of Electrical and Electronics Engineers I ...

Страница 53: ...age RTS Request to Send RXD Receive Data TBD To Be Determined TXD Transmit Data UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus VIHmax Maximum High level Input Voltage VIHmin Minimum High level Input Voltage VILmax Maximum Low level Input Voltage VILmin Minimum Low level Input Voltage VOLmax Maximum Low level Output Voltage VOHmin Minimum High level Output Voltage Vnom No...

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