Quectel FC909A, Руководство пользователя

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Wi-Fi&Bluetooth Module Series
FC909A_Hardware_Design 8 / 49
Figure Index
Figure 1: VBAT Circuit Reference Design ............................................................................................... 20
Figure 2: Power On Timing ..................................................................................................................... 21
Figure 3: Recommended Reference Design Circuit ................................................................................ 22
Figure 4: WLAN Application Interfaces Connection ................................................................................. 22
Figure 5: SDIO Interface Connection ...................................................................................................... 24
Figure 6: Block Diagram of Bluetooth Application Interfaces Connection ................................................ 27
Figure 7: Reference Design for UART Connection .................................................................................. 28
Figure 8: PCM Interface Connection ....................................................................................................... 29
Figure 9: Reference Circuit for RF Antenna Interface ............................................................................. 33
Figure 10: Microstrip Design on a 2-layer PCB ....................................................................................... 33
Figure 11: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 34
Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 34
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 34
Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .......................................................... 36
Figure 15: Mechanicals of U.FL-LP Connectors ...................................................................................... 36
Figure 16: Space Factor of Mated Connector (Unit: mm) ........................................................................ 37
Figure 17: Top and Side Dimensions ...................................................................................................... 42
Figure 18: Bottom Dimension .................................................................................................................. 43
Figure 19: Recommended Footprint (Top View)...................................................................................... 44
Figure 20: Top and Bottom Views of FC909A ......................................................................................... 45
Figure 21: Recommended Reflow Soldering Thermal Profile .................................................................. 47
Figure 22: Carrier Tape Dimension Drawing ....................................................................................... 49
Figure 23: Plastic Reel Dimension Drawing ........................................................................................ 49
Figure 24: Packaging Process................................................................................................................. 50