40
/
50
EP06 Module
Application Board
Thermal Pad
Shielding Cover
MiniPCIe Connector
Application Board
EP06 Module
PCBA
Thermal Pad
Figure 14: Referenced Thermal Pad Design
1.
Make sure that customers’ PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2.
The module’s internal temperature must be kept below 105°C to protect the components from
damage when it is integrated to customers’ applications. And the temperature can be queried by
AT+QTEMP
command.
NOTES
