39
/
50
4.7.
Thermal Consideration
EP06 is designed to work over an extended temperature range. In order to achieve a maximum
performance, it is strongly recommended to comply with the following principles for thermal consideration.
On customers’ PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply, etc.
According to customers’ application demands, the heatsink can be mounted on the top of the module,
or the thermal pad can be filled between the module and the application board and the corresponding
area on the application board need as much GND copper as possible, or both of them.
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows the heatsink and thermal pad designs for reference and customers can choose one
or both of them according to their application structure.
Heatsink
EP06 Module
Application Board
Thermal Pad
Shielding Cover
MiniPCIe Connector
Application Board
Heatsink
Heatsink
EP06 Module
PCBA
Figure 13: Referenced Heatsink Design (Heatsink at the Top of the Module)
LTE-TDD B41+B41 @21.25dBm
TBD
mA
WCDMA
voice call
WCDMA B1 CH10700 @23.75dBm
596.7
mA
WCDMA B3 CH1122 @22.6dBm
576.63
mA
WCDMA B5 CH4408 @ 22.22dBm
557.01
mA
WCDMA B8 CH3012 @22.98dBm
638.67
mA
