LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 115 / 130
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute
AT+QTEMP
command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to
document [7]
.
NOTES
