LPWA Module Series
BG96 Hardware Design
BG96_Hardware_Design 3 / 79
Table 35.
6. Updated the module
’s baking temperature and baking
hours in Chapter 8.1.
7. Updated the recommended reflow soldering thermal
profile and related parameters in Chapter 8.2.
1.4
2019-08-15
Lyndon LIU/
Rex WANG
1. Added B25 and the note thereof.
2. Updated supported internet protocols and USB serial
drivers in Table 2.
3. Updated functional diagram in Figure 1.
4. Enabled W_DISABLE# for airplane mode control in
Chapter 3.4.1.
5. Updated DC characteristics of PWRKEY (Table 4,
Table 7).
6. Updated DC characteristics of RESET_N (Table 4,
Table 8).
7. Updated the description of power supply reference
design in Chapter 3.5.2.
8. Updated power-on timing of the module in Figure 8.
9. Added ADC analog-input bandwidth and ADC
sampling rate in Table 22.
10. Updated the GPIO configuration command in Chapter
3.17.
11. Updated BG96 operating frequency in Table 27.
12. Updated GNSS frequency in Table 29.
13. Updated BG96 current consumption in Table 34.
14. Updated the recommended stencil thickness and the
peak reflow temperature in Chapter 8.2.
15. Updated packaging information of the module in
Chapter 8.3.
