Promise VSky H3970hDM, Руководство по эксплуатации продукта

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Dimensions
Height: 174.75mm
Width: 430mm
Length: 900mm
Processor
Dual Processors Intel® Xeon E5-2600 product family
• Intel Socket R (LGA2011)
• 95W, 80W and LV (low power)
• Up to 8 execution cores
• Hyper-Threading
• Turbo boost
• PCIe Gen3
• QPI 8.0 GT/s
Chipset Intel C600 Patsburg-A
Memory
16 xDDR3 with ECC DIMM slots
• 8 DDR3 channels per CPU.
• Unbuffered DDR3 and registered DDR3 DIMMs
• LR DIMM (Load Reduced DIMM).
• DDR3 standard I/O Voltage of 1.5 V and DDR3 Low Voltage of
1.35 V
• Memory DDR3 data transfer rates of 800, 1066, 1333 and 1600
MT/s.
• 1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported for
these devices:
• UDIMMs x8, x16
• RDIMMs x4, x8
• LRDIMM x4, x8
• Up to 8 ranks supported per memory channel, 1, 2 or 4 ranks per
DIMM.
• 128GB max memory limit per processor, 16GB DIMM modules
available at launch. There are two processors per motherboard for
a total of 256GB per motherboard.
Expansion Slots
PCI-Express x16 riser slot (Gen-3) (from CPU0)
PCI-Express x8 riser slot (Gen-3) (from CPU0)
VGA
ASPEED AST2300 / AST 1300 embedded.
• Max Display resolution: 1900x1200 32bpp@60Hz
• VGA memory size: 64MB with AST1300 / 8M with AST2300
(DDR3)
A
ppendix
b: s
pecificAtions
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VSky H3970 Product Manual Promise Technology, Inc.