FEDD56V16160F-02
1
Semiconductor
MSM56V16160F
16/31
Bank Interleave Random Row Write Cycle @
CAS
Latency=2, Burst Length=4
CLK
CKE
CS
RAS
CAS
ADDR
A11
A10
DQ
WE
UDQM,
LDQM
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
RAa
CAa
RBb CBb
RAc CAc
RAa
RBb RAc
DAa0 DAa1 DAa2 DAa3
Row Active
(A-Bank)
Write Command
(A-Bank)
Precharge Command
(A-Bank)
Row Active
(B-Bank)
Write Command
(B-Bank)
Precharge Command
(B-Bank)
Row Active
(A-Bank)
Write Command
(A-Bank)
DBb0 DBb1 DBb2 DBb3
DAc0 DAc1
High
Precharge Command
(A-Bank)
Содержание CE130/55
Страница 8: ...3 BLOCK DIAGRAM ...
Страница 9: ...4 WIRING DIAGRAM ...
Страница 10: ...5 CIRCUIT DIAGRAM MAIN BOARD ...
Страница 11: ...6 CIRCUIT DIAGRAM MAIN BOARD ...
Страница 14: ...MAIN PCB COMPONENT LAYOUT TOP SIDE VIEW 9 ...
Страница 15: ...MAIN PCB COMPONENT LAYOUT BOTTOM SIDE VIEW 10 ...
Страница 16: ...PANEL PCB COMPONENT LAYOUT TOP SIDE VIEW 11 ...
Страница 17: ...PANEL PCB COMPONENT LAYOUT BOTTOM VIEW PANEL PCB COMPONENT LAYOUT BOTTOM VIEW 12 ...
Страница 18: ...TUNER PCB COMPONENT LAYOUT TOP SIDE VIEW 13 ...
Страница 19: ...TUNER PCB COMPONENT LAYOUT BOTTOM IDE S VIEW 14 ...
Страница 20: ...SET EXPLODER VIEW DRAWING 15 ...
Страница 22: ...BX8804 8805 User s Manual Revision 0 93 May 23 2008 ...
Страница 30: ...BX8804 8805 9 21 1 PRODUCT OVERVIEW ...
Страница 39: ...BX8804 8805 18 21 20 PACKAGE DIMENSIONS ...
Страница 41: ...BX8804 8805 20 21 21 ELECTRICAL CHARACTERISTICS ...