25
Chapter 3
System architecture
Chapter contents
CompactPCI form factor
.......................................................................................................................................26
Board front panels
...........................................................................................................................................27
Transition boards
............................................................................................................................................27
Pin and socket connectors
......................................................................................................................................29
J1/P1 & J2/P2 connectors
...............................................................................................................................30
J3/P3 through J5/P5 connector
.......................................................................................................................30
Reserved pins
..................................................................................................................................................30
Power pins
......................................................................................................................................................30
Backplane architecture
...........................................................................................................................................30
Slot designation
..............................................................................................................................................32
Backplane power distribution
................................................................................................................................32
External power connections
............................................................................................................................33
Front panel keying for power supplies
.............................................................................................................33
Hot-swap capability
...............................................................................................................................................33