Be certain each pin is located over the correct pad on the PCB.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins while feeding enough solder to the
tip so that it flows under the pins as they are heated.
11.3. Modification Procedure of Bridge
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of the
pin to draw the solder from between the adjacent pads.
12. TERMINAL GUIDE OF ICs, TRANSISTORS AND
DIODES
23
Содержание KX-TSC10EXB
Страница 3: ...1 BATTERY 3 ...
Страница 4: ...2 LOCATION OF CONTROLS 4 ...
Страница 5: ...3 DISPLAY 5 ...
Страница 6: ...4 SETTINGS 4 1 Connecting the Handset Telephone Line Cord 6 ...
Страница 8: ...4 3 How to Release the Establishment of Dial Lock 8 ...
Страница 10: ...4 4 Call Restricstion 10 ...
Страница 11: ...5 OPERATIONS 5 1 Making Calls 11 ...
Страница 12: ...5 2 Answering Calls 12 ...
Страница 15: ...7 2 Tone Dialing Problems handset 7 3 No Ringing Sound When Ring Signal is Input 15 ...
Страница 19: ...19 ...
Страница 20: ...10 2 CPU DATA IC801 10 3 RINGER IC IC2 20 ...
Страница 21: ...10 4 EEPROM IC802 1 SCK 21 ...
Страница 24: ...13 CABINET AND ELECTRICAL PARTS 24 ...
Страница 25: ...14 ACCESSORIES AND PACKING MATERIALS 25 ...
Страница 26: ...26 ...
Страница 39: ...LCD1 KX TSC10EXB C W CIRCUIT BOARD CPU Flow Sloder Side View ...