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1. When all of the IC lead can not been seen at the standard degree,
fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up
directly in the P.C.board’s pattern. If you do not fill with large quantities of solder as in step 1
the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with
the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same
time.)
After removing the Flat IC and when attaching the new IC, remove any of the excess solder on
the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC
will slip and not be attached properly.
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Содержание KX-T7565X
Страница 3: ...4 DISASSEMBLY INSTRUCTION 4 1 HOW TO REMOVE THE LOWER CABINET Procedure 1 3 ...
Страница 6: ...5 IC DATA 5 1 IC1 6 ...
Страница 9: ...9 ...
Страница 24: ...9 4 SPEAKER PHONE TROUBLE 9 5 TONE DIAL TROUBLE 9 6 HANDSET TROUBLE 24 ...
Страница 25: ...10 WAVEFORM 11 TERMINAL GUIDE OF IC S TRANSISTORS AND DIODES 25 ...
Страница 26: ...12 CABINET AND ELECTRICAL PARTS LOCATION 26 ...
Страница 27: ...13 ACCESSORIES AND PACKING MATERIALS 27 ...
Страница 36: ...EP2 9 KEY INPUT KEY ON 13 INT RX INT TX 10 KEY SIGNAL 14 A0 A1 IOR IOW 11 16 384MHz 15 D0 D1 D2 D3 12 8MHz 16 ...