6.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked
pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by
sliding the soldering iron.
6.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as
shown in the figure below.
7. BLOCK DIAGRAM
8. CIRCUIT OPERATIONS
8.1. KEY INPUT CONTROL CIRCUIT
(1) CIRCUIT OPERATION
13
Содержание KX-T7565X
Страница 3: ...4 DISASSEMBLY INSTRUCTION 4 1 HOW TO REMOVE THE LOWER CABINET Procedure 1 3 ...
Страница 6: ...5 IC DATA 5 1 IC1 6 ...
Страница 9: ...9 ...
Страница 24: ...9 4 SPEAKER PHONE TROUBLE 9 5 TONE DIAL TROUBLE 9 6 HANDSET TROUBLE 24 ...
Страница 25: ...10 WAVEFORM 11 TERMINAL GUIDE OF IC S TRANSISTORS AND DIODES 25 ...
Страница 26: ...12 CABINET AND ELECTRICAL PARTS LOCATION 26 ...
Страница 27: ...13 ACCESSORIES AND PACKING MATERIALS 27 ...
Страница 36: ...EP2 9 KEY INPUT KEY ON 13 INT RX INT TX 10 KEY SIGNAL 14 A0 A1 IOR IOW 11 16 384MHz 15 D0 D1 D2 D3 12 8MHz 16 ...