17. When complete solder melt is observed, release the handpiece Cycle
Switch (to cease air flow) and gently lift the handpiece from the PCB.
NOTE
Any required preheating should be
completed before advancing beyond this
point.
Figure 38.
16. If vacuum is being used to hold component, depress and hold the Vacuum
Pick Switch for 0.5 second (minimum) to stop vacuum and release the
component. Release the Vacuum Pick Switch.
14. Press and hold the handpiece Cycle Switch to activate heat
cycle.
15. If using a Single Jet nozzle in a hand held operation, move the
handpiece as necessary to direct air flow to the solder areas
requiring reflow.
Heated air is now being applied to the rework area.
Handpiece
Handpiece
Figure 37.
39
Operation
MANUAL MODE COMPONENT INSTALLATION (CONT'D)
Содержание TF 200
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