3
TF 1000 BGA/CSP Rework Station
A. Introduction
As electronic assemblies get smaller and lighter, PCB’s are steadily decreasing
in size, and semiconductor devices are slowly being replaced by smaller area
array packages such as BGA’s and CSP’s. The TF-1000 has been specifically
designed for the rework of these devices, with an emphasis on small boards and
components.
B. Regulation
The TF-1000 is in conformity with the European Machinery Directive 98/37/EC
and EMC Directive 89/336/EMC, modified 92/31/ECC, 93/68/EEC.
Caution!
During normal operation, the top heater, nozzle, bottom-side-heater(s) and
halogen lamps will get hot. Contacting them directly may result in serious
injury.
