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Appendix A: XE
–900 SBC technical data
Technical specifications
CPU
VIA Eden ESP, 400 MHz, 733 MHz or 1 GHz
Front Side Bus
133 MHz
PCI bus clock
33 MHz
ISA bus clock
8.33 MHz
BIOS
AT compatible with industrial extensions
SDRAM
0 MB SDRAM supplied. SO-DIMM socket can be populated with up to 256 MB
SDRAM using PC100 or PC133 memory sticks. Some low-power 512 MB SO–
DIMM modules are also supported. Contact Octagon Systems for compatibility
before using 512 MB modules.
On-board flash
512 KB socketed flash, contains system BIOS
Hard drive
EIDE hard drive support with on-card hard drive controller and BIOS. Accessed
via 44-pin connector. Supports up to three EIDE devices. CompactFlash appears as
the primary EIDE device.
CompactFlash socket
Supports Type I and Type II 3V CompactFlash devices.
USB
2 ports USB 1.1 compatible
Serial I/O
Six ports with RS–232, RS–422, RS–485, or TTL interfaces
IEC1000, level 3, ESD protection specification
— Contact discharge ±6 kV
— Air–gap discharge ±8 kV
Backdrive protection
16C550 compatible
Up to 115.2K baud
16-byte FIFO buffers
Switch-selectable terminations for RS–422/485 on COM5/6
Digital I/O
24 I/O lines, sink/source 15mA per line
Keyboard and mouse ports
PS/2 compatible
Ethernet
One 10/100BaseT port supporting IEEE 802.3
Содержание XE-900
Страница 19: ...19 Figure 2 1 XE 900 SBC component diagram top ...
Страница 20: ...20 Figure 2 2 XE 900 SBC component diagram bottom ...
Страница 21: ...21 Figure 2 3 XE 900 SBC dimensions without Integrated Conductive Cooling System ...
Страница 38: ...38 ...
Страница 91: ...91 Figure 15 2 Dimensions for the Integrated Conductive Cooling System ...