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2004 Jan 28

NXP Semiconductors

Product specification

22 W BTL or 2



11 W

stereo power amplifier

TDA1519C

BLOCK DIAGRAM

mgl491

input

reference

voltage

power
ground
(substrate)

+
+

signal
ground

183

18.1 kW

TDA1519C

TDA1519CSP

15 kW

mute switch

power stage

standby
reference
voltage

mute
reference
voltage

NINV

INV

OUT2

M/SS

OUT1

GND1

GND2

183

18.1 kW

mute switch

power stage

mute
switch

standby

switch

×1

Fig.1 Block diagram.

The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4.

Содержание TDA1519C

Страница 1: ...DATA SHEET Product specification Supersedes data of 2001 Aug 24 2004 Jan 28 INTEGRATED CIRCUITS TDA1519C 22 W BTL or 2 11 W stereo power amplifier...

Страница 2: ...with TDA1519B TDA1519C and TDA1519CSP GENERAL DESCRIPTION The TDA1519C is an integrated class B dual output amplifier in a 9 lead plastic single in line power package or 20 lead heatsink small outline...

Страница 3: ...ut current 4 A Iq tot total quiescent current 40 80 mA Istb standby current 0 1 100 A Isw on switch on current 40 A Inputs Zi input impedance BTL 25 k stereo 50 k Stereo application Po output power TH...

Страница 4: ...nd 2 7 9 6 183 W 18 1 kW 3 TDA1519C TDA1519CSP 15 kW 15 kW VA VA Cm mute switch power stage 60 kW standby reference voltage mute reference voltage 1 NINV RR INV OUT2 M SS OUT1 GND1 GND2 VP 4 8 183 W 1...

Страница 5: ...itch input INV 9 12 12 inverting input n c 2 4 6 7 9 and 13 to 18 2 4 6 7 9 and 13 to 18 not connected NINV GND1 RR OUT1 GND2 OUT2 VP M SS INV 1 2 3 4 5 6 7 8 9 TDA1519C TDA1519CSP mgr561 Fig 2 Pin co...

Страница 6: ...cordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VP supply voltage operating 17 5 V non operating 30 V load dump protected during 50 ms tr 2 5 ms 45...

Страница 7: ...1519CTH and TDA1519CTD in free air 40 K W Rth j c thermal resistance from junction to case TDA1519C TDA1519CTH and TDA1519CTD 3 K W SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply VP supply voltag...

Страница 8: ...n 39 40 41 dB SVRR supply voltage ripple rejection on notes 3 and 4 40 dB on notes 3 and 5 45 dB mute notes 3 and 6 45 dB standby notes 3 and 6 80 dB Zi input impedance 50 60 75 k Vn o rms noise outpu...

Страница 9: ...f 2 V 4 Frequency f 100 Hz 5 Frequency between 1 and 10 kHz 6 Frequency between 100 Hz and 10 kHz 7 Noise voltage measured in a bandwidth of 20 Hz to 20 kHz 8 Noise output voltage independent of RS Vi...

Страница 10: ...B 9 5 4 6 inverting input non inverting input internal 1 2 VP VP power ground 2 signal ground TDA1519C 3 8 7 standby switch mgl493 Fig 6 Stereo application diagram TDA1519C 2200 F 100 nF 220 nF 60 kW...

Страница 11: ...o power amplifier TDA1519C 0 20 60 30 40 50 mgr539 4 8 12 16 Iq tot mA VP V Fig 8 Total quiescent current as a function of the supply voltage 0 20 30 0 10 20 mgr540 4 8 12 16 Po W VP V THD 10 0 5 Fig...

Страница 12: ...er TDA1519C 12 0 10 1 1 10 102 mgr541 4 8 THD Po W Fig 10 Total harmonic distortion as a function of the output power BTL application RL 4 fi 1 kHz 0 6 0 10 102 103 104 mgu377 0 2 0 4 THD fi Hz Fig 11...

Страница 13: ...1 0 75 0 60 0 48 0 38 24 0 23 6 20 0 19 6 10 2 54 12 2 11 8 3 4 3 1 A max 1 2 Eh 6 2 00 1 45 2 1 1 8 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum pe...

Страница 14: ...25 0 75 0 60 24 0 23 6 0 48 0 38 10 20 0 19 6 12 2 11 8 2 54 3 4 2 8 2 1 1 9 6 3 0 2 00 1 45 3 4 3 1 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum p...

Страница 15: ...stic or metal protrusions of 0 25 mm maximum per side are not included HSOP20 plastic heatsink small outline package 20 leads SOT397 1 D bp Z D1 D2 E1 e 1 10 20 11 pin 1 index detail X Lp Q A A4 A3 A1...

Страница 16: ...stic or metal protrusions of 0 25 mm maximum per side are not included SOT418 3 0 5 10 mm scale HSOP20 plastic heatsink small outline package 20 leads low stand off height SOT418 3 A max detail X A2 3...

Страница 17: ...ispensing before package placement Several methods exist for reflowing for example convection or convection infrared heating in a conveyor type oven Throughput times preheating soldering and cooling v...

Страница 18: ...ion Packing Methods 3 For SDIP packages the longitudinal axis must be parallel to the transport direction of the printed circuit board 4 Hot bar soldering or manual soldering is suitable for PMFP pack...

Страница 19: ...TSSOP VSO and VSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm 10 Hot bar or manual soldering is...

Страница 20: ...uding negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors aggregate and cumulative liabi...

Страница 21: ...regard to the purchase of NXP Semiconductors products by customer No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for ac...

Страница 22: ...on presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher f...

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