NXP Semiconductors TDA1519C, Техническое описание

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2004 Jan 28 13
NXP Semiconductors Product specification
22 W BTL or 2

11 W
stereo power amplifier
TDA1519C
PACKAGE OUTLINES
UNIT A
b
max.
b
p 2
c D
(1)
E
(1)
Z
(1)
d e D
h
L j
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.4
1.1
0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6
10 2.54
12.2
11.8 3.4
3.1
A
max.
1
2
E
h
6
2.00
1.45 2.1
1.8
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
17.2
16.5
SOT131-2
99-12-17
03-03-12
0 5 10 mm
scale
Q
0.25
w
0.03
x
D
L
A
E
c
A 2
Q
w
M
b
p
d
D
Z
e
x
h
1 9
Eh
non-concave
seating plane
1
b
j
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
view B: mounting base side
B