2004 Jan 28
2
NXP Semiconductors
Product specification
22 W BTL or 2
11 W
stereo power amplifier
TDA1519C
FEATURES
Requires very few external components for Bridge-Tied
Load (BTL) operation
Stereo or BTL application
High output power
Low offset voltage at output (important for BTL
applications)
Fixed gain
Good ripple rejection
Mute/standby switch
Load dump protection
AC and DC short-circuit safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
= 0 V)
No switch-on/switch-off plops
Protected against electrostatic discharge
Low thermal resistance
Identical inputs (inverting and non-inverting)
Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1519C
SIL9P
plastic single in-line power package; 9 leads
SOT131-2
TDA1519CSP
SMS9P
plastic surface mounted single in-line power package; 9 leads
SOT354-1
TDA1519CTD
HSOP20
plastic, heatsink small outline package; 20 leads
SOT397-1
TDA1519CTH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
