NXP Semiconductors
UM11802
RDGD3162I3PH5EVB three-phase inverter reference design
Figure 10. SiC module pin connections
Connection name Pin description
G_HU
gate high-side U phase
E_HW
emitter/drain connection high-side U phase
COL_HU
collector/source connection high-side U phase
NTCU1
NTC temperature sensor connection U phase (high-side TSENSEA)
NTCU2
NTC temperature sensor connection U phase (high-side isolated ground)
G_LU
gate low-side U phase
COL_LU
collector/source connection low-side U phase
E_LU
emitter/drain connection low-side U phase
NTCV1
NTC temperature sensor connection V phase (high-side TSENSEA)
NTCV2
NTC temperature sensor connection V phase (high-side isolated ground)
G_HV
gate high-side V phase
COL_HV
collector/source connection high-side V phase
E_HV
emitter/drain connection high-side V phase
G_LV
gate low-side V phase
E_LV
emitter/drain connection low-side V phase
COL_LV
collector/source connection low-side V phase
NTCW1
NTC temperature sensor connection W phase (high-side TSENSEA)
NTCW2
NTC temperature sensor connection W phase (high-side isolated ground)
G_HW
gate high-side W phase
Table 6. SiC module pin connections
UM11802
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User manual
Rev. 1 — 10 June 2022
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