CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15075EJ2V1UD
339
Table 23-1. Surface Mounting Type Soldering Conditions (3/3)
(4)
µ
PD789425GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789426GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789435GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789436GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789445GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789446GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789455GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789456GK-
×××
-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD789425GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789426GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789435GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789436GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789445GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789446GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789455GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD789456GB-
×××
-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD78F9436GK-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD78F9456GK-9ET-A: 64-pin plastic TQFP (12
×
12)
µ
PD78F9436GB-8EU-A: 64-pin plastic LQFP (10
×
10)
µ
PD78F9456GB-8EU-A: 64-pin plastic LQFP (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds max. (at 220
°
C or higher),
Count: Three times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C
for 20 to 72 hours)
IR60-207-3
Wave soldering
When the pin pitch of the package is 0.65 mm or more, wave soldering can also be
performed.
For details, contact an NEC Electronics sales representative.
−
Partial heating
Pin temperature: 350
°
C max., Time: 3 seconds max. (per pin row)
−
Caution Do not use different soldering methods together (except for partial heating).
Содержание U789436 Series
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