User’s Manual U14826EJ5V0UD
197
CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
The
µ
PD789860, 789860(A), 789861, 78E9860A, and 78E9861A should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index/html)
Table 23-1. Surface Mounting Type Soldering Conditions (1/2)
µ
PD789860MC-
×××
-5A4:
20-pin plastic SSOP (7.62 mm (300))
µ
PD789861MC-
×××
-5A4:
20-pin plastic SSOP (7.62 mm (300))
µ
PD789860MC(A)-
×××
-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max. Time: 3 seconds max. (per pin row)
−
Caution Do not use different soldering method together (except for partial heating).
Содержание PD789860
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