October 26, 2007
6880309U09-A
6-34
Disassembly/Reassembly Procedures
: Replacement Procedures
6.2.3.4.2 PA-Unit Board Kit Reassembly
1. Use a soft cloth to remove any remaining residue. Put the thermal compound to the chassis
as shown in
NOTE:
6.3: “Chassis Thermal Compound Replacement Procedure” on page 6-47
Figure 6-62. Location for Thermal Compound.
2. Hold the PA-unit board kit [20] by its edges only, and take it out from an antistatic bag. Check
the replacement PA unit. There should not be any transistor fins vent shape and crack at the
solder joint points
3. Place the PA-unit board kit [20] into place by gently pushing down the PCB to fully seat it as
shown in
. Move the PCB gently, 2 or 3 times to exclude any air gaps between
both surfaces. Ensure that the PA-unit board kit alignment holes are positioned over the
chassis alignment bosses and that the Main-unit board kit is fully seated.
Figure 6-63. Placing PA-Unit Board Kit into Chassis.
4. Using a CR-V PH2 torque driver, fasten the 5 SEMS screws ASM3x8 NI [22] following the
. (Torqued to 4.6–5.8 kgf*cm/ 4–5 in. lbs)
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