
MC9S12DT256 Device User Guide — V03.07
95
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics
1
NOTES
:
1. The values for thermal resistance are achieved by package simulations
Num C
Rating
Symbol
Min
Typ
Max
Unit
1
T Thermal Resistance LQFP112, single sided PCB
2
2. PC Board according to EIA/JEDEC Standard 51-2
θ
JA
-
-
54
o
C/W
2
T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
3
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
-
-
41
o
C/W
3
T Thermal Resistance LQFP 80, single sided PCB
θ
JA
-
-
51
o
C/W
4
T
Thermal Resistance LQFP 80, double sided PCB
with 2 internal planes
θ
JA
-
-
41
o
C/W
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