MC9S12DT256 Device User Guide — V03.07
93
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
A
and the junction temperature T
J
. For power dissipation
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
) in
°
C can be
obtained from:
Table A-4 Operating Conditions
Rating
Symbol
Min
Typ
Max
Unit
I/O, Regulator and Analog Supply Voltage
V
DD5
4.5
5
5.25
V
Digital Logic Supply Voltage
1
NOTES
:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
V
DD
2.35
2.5
2.75
V
PLL Supply Voltage
V
DDPLL
2.35
2.5
2.75
V
Voltage Difference VDDX to VDDR and VDDA
∆
VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆
VSSX
-0.1
0
0.1
V
Oscillator
f
osc
0.5
-
16
MHz
Bus Frequency
f
bus
0.5
-
25
MHz
MC9S12DT256C
Operating Junction Temperature Range
T
J
-40
-
100
°
C
Operating Ambient Temperature Range
2
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature T
A
and device junction temperature T
J
.
T
A
-40
27
85
°
C
MC9S12DT256V
Operating Junction Temperature Range
T
J
-40
-
120
°
C
Operating Ambient Temperature Range
T
A
-40
27
105
°
C
MC9S12DT256M
Operating Junction Temperature Range
T
J
-40
-
140
°
C
Operating Ambient Temperature Range
T
A
-40
27
125
°
C
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