HARDWARE PREPARATION AND INSTALLATION
M68HC11EVBU/D
2-17
2.5
WIRE-WRAP AREA
The EVBU provides a small wire-wrap area for MCU custom interfacing. The wire-wrap area is
approximately 3.0 inches square, consisting of 29 holes wide by 30 holes high. The holes are on
one-tenth inch centers. Figure 2-2 illustrates an exploded view of the wire-wrap area. A ground
(GND) bus strip resides on the outside parameter of the wire-wrap area. A +5 Vdc bus is also
provided at the upper left end of the wire-wrap area.
With the wire-wrap hole pattern provided, dual-in-line package (DIP) device wire-wrap sockets,
strip sockets, headers, and connectors can be installed. Wire-wrap components can be installed
on the top side of the EVBU, and wire wrapping can be performed on the bottom side of the
EVBU. The use of three-quarter or one inch standoffs are recommended for wire-wrap pin
clearance on the bottom side of the EVBU. The standoff mounting holes are shown below.
P4
P2
WIRE-WRAP
AREA
P5
Two 60-pin MCU I/O port connectors P4 and P5 are provided on the EVBU. Connector P4 is
factory supplied and connector P5 is user supplied. Refer to the parts list contained in Chapter 6
for connector P5 component description. As shown on the following page, connector P5 supplies
the EVBU wire-wrap area with the +5 Vdc and ground (GND) power connections.
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