6. BLOCK DIAGRAM
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Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
6.BLOCK DIAGRAM
Total Block Diagram(EU)
PACT
30
LGE Internal Use Only
1-1. Total Block Diagram(EU)
XMM6260
M
EM
I/
F
D
i3
R
F
I/F
256Mb DDR
SDRAM
1Gb NAND
Touch Driver
LCD 4.57”
LCD Backlight
1280 x 720
Touch Screen
LCD C/P(Booster)
I2S2
uUSB
connector
MCP
RGB I/F
GEN2_I2C
SDMMC3
AP30
SDMMC4[0:7]
UART2
SDMMC5(WLAN)
ASM
Duplexer
Bank
Transceiver
PMB5712
MMMB
(PAM)
RF
26M
USIM
U
SI
M
I/
F
MIPI_HSI
USB_HSIC_DATA
GPIO
GPIO
SW
M
U
IC
U
SB
UART4
USB
UART
Charger
Proximity & Ambient Light sensor
Gyro Sensor
DAP3
BT PCM
HS USB
USIF1
UART1
GEN2_I2C
BCM4330x
BT
Wi-Fi
Compass Sensor
Motion Sensor
LCD data[0:23]
37.4M
32.768K
Camera
8M / AF
CSI_A
CSI_B
CAM_I2C
A-GPS
GSD5t
26M
UART3
MIPI I/F
MIPI I/F
SW
PMIC
(MAX77663)
32.768KHz
Fuel gauge
(MAX17043G)
BQ24260
GEN1_I2C I2S
3.5 pi ear-jack
Receiver
Speaker
Sub Mic
Main Mic
PWR_I2C
1830mAh
AUDIO CODEC
(MAX98089)
Motor
VBAT
KEY
KPD
CAM_I2C
VT Cam
1.26M
GEN1_I2C
X-TAL
GEN1_I2C
Motor
Driver
BACKUP
BAT
GPS
LNA
USB_HSIC_STRB
Thermal
Sensor
VCHG
SUB
PMIC
VCHG
FLASH LED Driver
Transceiver
PMU
PAM
DC/DC
JT
A
G
JT
A
G
VD
D
JT
A
G
MHL
NFC
HDMI
SW
PWR_I2C
CAM_I2C
DDR[0:31]
8Gb_LPDDR
16GB eMMC
MCP
PWR_I2C
AP_THERM
BAT_TEMP
26MHz
PWR_I2C
LCD
Bridge(Solomon)
MIPI I/F
SDIO
• MIPI(Mobile Industry Processor Interface)
• CSI(Camera Serial Interface)
• MCP(Multi Chip Package)
• SPI(Serial Peripheral Interface)
• SDIO(Secure Digital Input Output)
• MHL(Mobile High Definition Link)
• HSIC(High Speed Inter Chip)
• SDMMC(Secure Digital Multi-Media Card)
GEN1_I2C
Control
Data