3. TECHNICAL BRIEF
- 27 -
Figure 3-10 AD6527 ARCHITECTURE
AD6527/AD6527B
AD6535
Audio Baseband
and Power
Management
DSP
SRAM
FLASH
MMI
USC
Peripheral
RF-Control
Subsystem
Subsystem
Subsystem
(ARM7TDMI
®
)
DMA and BUS
ARBITRATION
Serial Link
DSP BUS
RBUS IM
EBUS
PBUS
SBUS
MUC
The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main
subsystems connected together through a dynamic and flexible communication bus network.
It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory,
Baseband converter functions, and terminal functions like MMI, SIM and Universal System
Connector (USC).
The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing,
channel equalization and channel codec functions. The code used to implement such functions
can be stored in external Flash Memory and dynamically downloaded on demand into the DSP’s
program RAM and Instruction Cache.
The micro-controller subsystem supports all the GSM terminal software, including the layer 1, 2
and 3 of the GSM protocol stack, the MMI, and applications software such as data services, test
and maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM
memory with a small dedicated routine to facilitate the initialization of the external Flash Memory
via code download using the on-chip serial interface to the external Flash Memory interface.
The peripheral subsystem is composed of system peripherals such as interrupt controller, real
time clock, watch dog timer, power management and a timing and control module. It also includes
peripheral interfaces to the terminal functions: keyboard, battery supervision, radio and display.
Both the DSP and the MCU can access the peripheral subsystem via the peripheral bus (PBUS).
For program and data storage, both the MCU subsystem and the DSP subsystem can access
the on chip system SRAM and external memory such Flash Memory. The access to the SRAM
module is made through the RAM Bus (RBUS) under the control of the bus arbitration logic.
Similarly, access to the Flash Memory is through the parallel External Bus (EBUS).
Содержание B2070
Страница 54: ... 53 4 TROUBLE SHOOTING 4 2 TX Trouble TEST POINT 13Mhz OSCILLATOR Mobile SW FEM TRANCEIVER LDO PAM ...
Страница 68: ... 67 4 TROUBLE SHOOTING TEST POINT 4 6 LCD Trouble ...
Страница 72: ... 71 4 TROUBLE SHOOTING TEST POINT 4 8 Speaker Trouble ...
Страница 79: ... 78 4 TROUBLE SHOOTING 4 11 KEY backlight Trouble TEST POINT ...
Страница 96: ...6 Press Start and Pover on the phone using JIG remote Power on Switch 1 5 DOWNLOAD AND CALIBRATION 95 ...
Страница 107: ... 106 8 PCB LAYOUT Figure 8 1 B2070 BOTTOM SIDE PCB LAYOUT ...
Страница 108: ... 107 8 PCB LAYOUT Figure 8 1 B2070 TOP SIDE PCB LAYOUT ...
Страница 109: ... 108 ...
Страница 117: ...10 STAND ALONE TEST 116 Figure 10 2 HW test setting Figure 10 3 Ramping profile ...
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