CP3003-SA
Thermal Considerations
ID 1052-6929, Rev. 3.0
Page 6 - 3
D R A F T — F O R I N T E R N A L U S E O N L Y
6.
Thermal Considerations
The following chapters provide system integrators with the necessary information to satisfy
thermal and airflow requirements when implementing CP3003-SA applications.
6.1
Board Internal Thermal Monitoring
To ensure optimal operation and long-term reliability of the CP3003-SA, all onboard compo-
nents must remain within the maximum temperature specifications. The most critical compo-
nents on the CP3003-SA are the processor and the chipset. Operating the CP3003-SA above
the maximum operating limits will result in permanent damage to the board.
The CP3003-SA includes several temperature sensors to measure the onboard temperature
values:
• Thermal sensors integrated in the processor
• Thermal sensor integrated in the chipset
6.2
Processor Thermal Monitoring
To allow optimal operation and long-term reliability of the CP3003-SA, the 3
rd
generation Intel®
Core™ i7 processor must remain within the maximum die temperature specifications. The max-
imum operating temperature for the processor die is 105°C.
The 3
rd
generation Intel® Core™ i7 processor uses the Adaptive Thermal Monitor feature to
protect the processor from overheating and includes the following on-die temperature sensors:
• One Digital Thermal Sensor (DTS) for monitoring each processor core
• One Digital Thermal Sensor (DTS) for monitoring the graphics core
• One Digital Thermal Sensor (DTS) for monitoring the die temperature
• Catastrophic Cooling Failure Sensor (THERMTRIP#)
These sensors are integrated in the processor and work without any interoperability of the uEFI
BIOS or the software application. Thermal Control Circuit in the uEFI BIOS allows the proces-
sor to maintain a safe operating temperature without the need for special software drivers or
interrupt handling routines.
6.2.1
Digital Thermal Sensor (DTS)
The 3
rd
generation Intel® Core™ i7 processor includes up to six on-die Digital Thermal Sensors
(DTS), up to four for the processor cores, one for the graphics core and one for the package
die. They can be read via an internal register of the processor. The temperature returned by
the Digital Thermal Sensor will always be at or below the maximum operating temperature
(105°C). Via the Digital Thermal Sensors, the uEFI BIOS or the application software can mea-
sure the processor die temperature.
6.2.2
Adaptive Thermal Monitor
The Adaptive Thermal Monitor feature reduces the processor power consumption and the tem-
perature when the processor silicon exceeds its maximum operating temperature until the pro-
cessor operates at or below its maximum operating temperature.
The processor core power reduction is achieved by:
• Frequency/sVID Control (by reducing of processor core voltage)
• Clock Modulation (by turning the internal processor core clocks off and on)
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