4200-900-01 Rev. K / February 2017
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Model 4200-SCS User’s Manual
Section 3: Common Device Characterization Tests
The endurance test is performed a set number of program and erase cycles (see
), while periodically measuring V
T
for both the programmed and
erased state.
shows typical degradation on a NOR cell for both V
TP
and V
TE
as the number of applied program/erase cycles increases.
Figure 3-90
Example results of V
T
shift in an Endurance test on a NOR flash cell.
Disturb testing
The purpose of the Disturb test is to pulse stress a device in an array test
structure, then perform a measurement, such as V
T
, on a device adjacent to the
pulsed device.
The goal is to measure the amount of V
T
shift in adjacent cells, either in the
programmed or erased states, when a nearby device is pulsed with either a
Program, Erase, or Erase waveform.
The typical measurement is a V
T
extraction based on a Vg-Id sweep, but any type
of DC test may be configured. This test is similar to the endurance test, but the
pulsing and measuring are performed on adjacent devices.
shows an example configuration to pulse stress a device (Cell 2) and
then test an adjacent device (Cell 1) in an array cell memory structure.
The solid-line blue circle indicates the cell to be pulse stressed, and the dotted-
line red circles are the adjacent memory cells that will be disturbed by the
stressing.
The stress / measure process is explained as follows.
Initial test conditions
– SMU4 outputs a DC voltage to turn on the control
devices for the array. This connects instrumentation at the top of array to the flash
memory cells. SMU2 and SMU3 are set to output 0 V. This ensures that only the
Cell 2 will be turned on during pulse stressing.
Pulse stressing
– The output relay for SMU1 is opened, and the gate and drain
of Cell 2 are pulse stressed by PG2 #1 (ch 1) and PG2 #2 (ch 1).
V
T
Program/Erase Cycles
10
10
2
10
3
10
4
10
5
10
6
V
TP
V
TE
Programmed State
Erased State
Voltage Threshold Window
Window Closure
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