P1D
T1D
LVA10923-
A1
P201
P200
TP201
J261
J2000
CN241
J201
TP212
TP211
TP232
TP231
<Sub AMP board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-06-18
No.MA473
(No.MA473<Rev.002>)23/31
Содержание KW-ADV793J
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Страница 37: ... MA473 R002 3 ...