<Front board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1D
S1D
A2
LVA10922-
MARK
UL
CN651
C6501
R6501
S6501
PbF
CN652
R6503
R6502 Q6501 Q6502
created date:2010-06-18
No.MA473
(No.MA473<Rev.002>)18/31
Содержание KW-ADV793J
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