Intel JBOD2312S3SP, Руководство по оборудованию

Страница: 14 / 47

Intel® Storage Server System JBOD2312S3SP Hardware Guide
4
2.2 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 1. System Environmental Limits Summary
Parameter Limits
Temperature
Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC 1
1
(50ºF to 95ºF) with the
maximum rate of change not to exceed 10ºC per hour.
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hrs per year.
Shipping -40ºC to 70ºC (-40ºF to 158ºF)
Altitude Operating Support operation up to 3050m with ASHRAE class deratings.
Humidity Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28ºC (at temperatures from
25ºC to 35ºC)
Shock
Operating Half sine, 2g , 11 mSec
Unpackaged Trapezoidal, 25g , velocity change is based on packaged weight
Packaged
Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged 5 Hz to 500 Hz 2.20 g RMS random
Packaged 5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage 90 V AC to 132 V AC and 180 V AC to 264 V AC
Frequency 47 Hz to 63 Hz
Source Interrupt No loss of data for power line drop-out of 12 mSec
Surge Non-
operating and
operating
Unidirectional
Line to earth Only
AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
ESD
Air Discharged 12.0 kV
Contact Discharge 8.0 kV
Acoustics Sound
Power Measured
Power in Watts <300 W ≥ 300 W ≥ 600 W ≥ 1000 W
Servers/Rack
Mount BA
7.0 7.0 7.0 7.0
System 460W Redundant Power Supplies (CRPS) operate in spread-core flow conditions (positive pressure
to the power supply’s inlet) and incorporate a 40mm fan for its own thermal management. To ensure PS
thermal protection under all operating conditions the fan speed control has a closed loop algorithm based
on both the critical component temperature and the ambient temperature (inlet temperature). The PS over
Temperature Protection (OTP) protects against over temperature conditions created by the loss of fan
cooling or excessive ambient temperature. In an OTP condition the PS will shut down and restore power
1
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to
cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the
amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.