Intel Intel E7500 MCH, Руководство по тепловому проектированию

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Thermal Design Guide 3
Contents
Contents
1.0 Introduction....................................................................................................................................5
1.1 Document Goals ................................................................................................................... 5
1.2 Document Scope .................................................................................................................. 5
1.3 Design Flow .......................................................................................................................... 5
1.4 Definition of Terms................................................................................................................ 6
1.5 Reference Documents ..........................................................................................................6
2.0 Packaging Technology .................................................................................................................7
3.0 Thermal Simulation ....................................................................................................................... 9
4.0 Thermal Specifications ...............................................................................................................11
4.1 Power..................................................................................................................................11
4.2 Die Temperature ................................................................................................................. 11
5.0 Thermal Metrology ......................................................................................................................13
5.1 Die Temperature Measurements ........................................................................................ 13
5.1.1
90° Angle Attach Methodology ..............................................................................13
5.1.2 0° Angle Attach Methodology ................................................................................ 14
5.2 Power Simulation Software.................................................................................................16
6.0 Reference Thermal Solution ....................................................................................................... 17
6.1 Operating Environment and Thermal Performance ............................................................ 17
6.2 Mechanical Design Envelope ............................................................................................. 18
6.3 Thermal Solution Assembly ................................................................................................ 19
6.3.1
Retention Method A ............................................................................................... 20
6.3.1.1
Heat Sink Orientations ........................................................................... 20
6.3.1.2 Board Level Keep-out Dimensions ........................................................ 20
6.3.1.3 Heat Sink Clip ........................................................................................ 22
6.3.1.4 Solder-Down Anchors ............................................................................ 22
6.3.2 Retention Method B ............................................................................................... 22
6.3.2.1
Heat Sink Orientations ........................................................................... 23
6.3.2.2 Board Level Keep-Out Dimensions........................................................ 23
6.3.2.3 Heat Sink Push-Pin ................................................................................ 24
6.3.3 Mechanical Interface Material ................................................................................ 24
6.3.4 Thermal Interface Material .....................................................................................24
6.4 Reliability Requirements ..................................................................................................... 25
7.0 Conclusion ................................................................................................................................... 27
A Thermal Solution Component Suppliers ................................................................................... 29
A.1 Extruded Pin Fin Heat Sink......................................................................................................... 29
A.2 Materials for Retention Method A ............................................................................................... 29
A.3 Materials for Retention Method B ............................................................................................... 29
A.4 Attach Hardware ......................................................................................................................... 30
B Mechanical Drawings .................................................................................................................. 31