Intel Intel E7500 MCH, Руководство по тепловому проектированию

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Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide 23
6.3.2.1 Heat Sink Orientations
Retention Method B supports an omni-directional placement for the heat sink. Airflow may pass
either perpendicular direction over the fins and the heat sink may be mounted in either the vertical
or horizontal position atop the MCH, depending on hole placement.
Aligning the heat sink 45° relative to the airflow is acceptable but delivers reduced thermal
performance.
6.3.2.2 Board Level Keep-Out Dimensions
Figure 13 shows the board component keep-out for Retention Method B.
Figure 13. Board Component Keep-out for Retention Method B
NOTE: Drawing dimensions are in inches and are not to scale.
Intel® E7500 Chipset MCH
Intel® E7501 Chipset MCH