Intel E7500, Руководство по тепловому проектированию

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R
4 Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
Figures
Figure 1. Thermal Design Process ......................................................................................8
Figure 2. MCH Package Dimensions (Side View) .............................................................11
Figure 3. MCH Package Dimensions (Top View) ..............................................................12
Figure 4. 0 Angle Attach Methodology (Top View) ............................................................18
Figure 5. 0° Angle Attach Heatsink Modifications..............................................................18
Figure 6. Thermal Solution Decision Flowchart.................................................................19
Figure 7. Reference Heatsink Volumetric Envelope for the MCH .....................................22
Figure 8. Reference Thermal Solution Assembly..............................................................23
Figure 9. Reference Thermal Solution Assembly (Side View)...........................................24
Figure 10. Reference Thermal Solution (Top View) ..........................................................24
Figure 11. Preferred Heatsink Orientation.........................................................................25
Figure 12. Extruded Heatsink Profile.................................................................................26
Figure 13. Alternate Tall Heatsink Profile ..........................................................................26
Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27
Figure 15. Heatsink Retention Mechanism Layout............................................................28
Figure 16. Retention Mechanism Component Keep-out Zones ........................................29
Figure 17. MCH Heatsink Assembly..................................................................................34
Figure 18. MCH Heatsink Clip ...........................................................................................35
Tables
Table 1. Intel
®
E7500 Chipset MCH Thermal Specifications.............................................15
Table 2. Intel
®
E7505 Chipset MCH Thermal Specifications.............................................15
Table 3. Reliability Guidelines............................................................................................30
Table 4. Complete Thermal Solution Kits ..........................................................................31
Table 5. Extruded Heatsinks .............................................................................................31
Table 6. Interface Materials ...............................................................................................32
Table 7. Attach Hardware..................................................................................................32