Thermal Specifications
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
15
4 Thermal
Specifications
4.1
Case Temperature and Thermal Design Power
The TDP specifications are provide in Table 1 for the E7500 chipset MCH and Table 2 for the
E7505 chipset MCH. FC-BGA packages have poor heat transfer capability into the board and have
minimal thermal capability without thermal solutions. Intel recommends that system designers plan
for one or more heatsinks when using the E7500/E7505 chipset.
4.2 Die
Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below
the values specified in Table 1 and Table 2. System and/or component level thermal solutions are
required to maintain die temperatures below the maximum temperature specification. Refer to
Chapter 5 for guidelines on accurately measuring package die temperatures.
Table 1. Intel
®
E7500 Chipset MCH Thermal Specifications
Parameter Maximum
T
case
102
°C
TDP 9
W
NOTE:
T
case
is defined as the maximum die temperature with the reference thermal solution attached.
Table 2. Intel
®
E7505 Chipset MCH Thermal Specifications
Parameter Maximum
T
case
105
°C
TDP 8
W
NOTE:
T
case
is defined as the maximum die temperature with the reference thermal solution attached.
