Thermal Metrology
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
19
5.2
Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on an
E7500/E7505 chipset MCH when used in conjunction with Intel
®
Xeon™ processor with 512-KB
L2 cache. The combination of the Xeon processor(s) with 512-KB L2 cache and the higher
bandwidth capability of the E7500/E7505 chipsets enable new levels of system performance. To
assess the thermal performance of the chipset MCH thermal solution under “worst-case realistic
application” conditions, Intel has developed a software utility that operates the chipset at near
worst-case power dissipation.
The utility has been developed solely for testing customer thermal solutions at near the thermal
design power. Figure 6 shows a decision flowchart for determining thermal solution needs. Real
future applications may exceed the thermal design power limit for transient time periods. For
power supply current requirements under these transient conditions, refer to each component’s
datasheet for the I
CC
(Max Power Supply Current) specification
.
Contact your Intel Field Sales
representative to obtain a copy of this software.
Figure 6. Thermal Solution Decision Flowchart
Start
Therm_Flowchart
Attach device to
board using
normal reflow
process
Attach thermocouples
using recommended
methodology. Setup
the system in the
desired configuation.
Run the power
program and
monitor the
device die
temperature.
Tdie >
Specification?
End
No
Yes
Heatsink
requied
Select
heatsink
