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Reference Thermal Solutions

R

Intel

®

E7500/E7505 Chipset MCH Thermal Design Guide

25

6.3.1 Heatsink

Orientations

To enhance the efficiency of the reference thermal solution, it is important for the designer to
orient the fins properly with respect to the mean airflow direction. Simulation and experimental
evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are
aligned with the mean airflow direction (Figure 11). Aligning the heatsink 45° relative to the
airflow is acceptable but delivers reduced thermal performance.

Figure 11. Preferred Heatsink Orientation

heatsk_orient

Orthogonal
Mean Air Flow
Direction

Parallel Mean
Air Flow
Direction

Fin

Orientation

Incorrect

Correct

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Содержание E7500

Страница 1: ...Intel E7500 E7505 Chipset Thermal Design Guide Intel E7500 E7505 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number 298647 002 R...

Страница 2: ...to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reser...

Страница 3: ...5 1 1 0 Angle Attach Methodology 17 5 2 Power Simulation Software 19 6 Reference Thermal Solutions 21 6 1 Operating Environment 21 6 2 Mechanical Design Envelope 21 6 3 Thermal Solution Assembly 23 6...

Страница 4: ...24 Figure 10 Reference Thermal Solution Top View 24 Figure 11 Preferred Heatsink Orientation 25 Figure 12 Extruded Heatsink Profile 26 Figure 13 Alternate Tall Heatsink Profile 26 Figure 14 Heatsink M...

Страница 5: ...l E7500 chipset specific document February 2002 002 Added Intel E7505 chipset specific information and re titled document Updated E7500 E7505 chipset MCH thermal specifications Removed 90 C Angle Atta...

Страница 6: ...R 6 Intel E7500 E7505 Chipset MCH Thermal Design Guide This page is intentionally left blank...

Страница 7: ...stem designer can ensure the proper functionality performance and reliability of the chipset Operation outside the functional limits can degrade system performance and may cause permanent changes in t...

Страница 8: ...system designer Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step Figure 1 Thermal Design Process Step 1 Thermal Simulation Thermal Models Ther...

Страница 9: ...Memory Controller Hub The chipset component that contains the processor interface and the memory interface FC BGA Flip Chip Ball Grid Array A package type defined by a resin fiber substrate where a di...

Страница 10: ...m Design Guide 298649 Intel E7500 Chipset E7500 Memory Controller Hub MCH Datasheet 290730 Intel Xeon Processor and Intel E7505 Chipset Platform Design Guide 251934 Intel E7505 Chipset Memory Controll...

Страница 11: ...age refer to the Intel 82870P2 PCI PCI X 64 bit Hub 2 P64H2 Thermal and Mechanical Design Guidelines and the Intel 82870P2 PCI PCI X 64 bit Hub 2 P64H2 Datasheet For information on the ICH3 S package...

Страница 12: ...A 10 16 20 3 5 7 9 11 13 15 19 4 6 18 8 12 14 22 21 24 23 26 25 28 27 30 29 31 32 n x 0 025 Min Metal Edge n x 0 790 0 025 Solder Resist Opening n x 0 650 0 040 Detail A 00 071 L C 00 200 L C A S B 3...

Страница 13: ...id system designers in simulating analyzing and optimizing their thermal solutions in an integrated system level environment The models are for use with the commercially available Computational Fluid...

Страница 14: ...Thermal Simulation R 14 Intel E7500 E7505 Chipset MCH Thermal Design Guide This page is intentionally left blank...

Страница 15: ...oper operation and reliability of the MCH the die temperatures must be at or below the values specified in Table 1 and Table 2 System and or component level thermal solutions are required to maintain...

Страница 16: ...Thermal Specifications R 16 Intel E7500 E7505 Chipset MCH Thermal Design Guide This page is intentionally left blank...

Страница 17: ...uple junction and the surface of the package heat loss by radiation and or convection conduction through thermocouple leads or contact between the thermocouple cement and the heatsink base if a heatsi...

Страница 18: ...Attach Methodology Top View Cement Thermocouple Bead angle_attach_1 Thermocouple Wire Die Substrate NOTE Not to scale Figure 5 0 Angle Attach Heatsink Modifications Angle_Attach_Heatsink_Mod 1 3 mm 0...

Страница 19: ...r dissipation The utility has been developed solely for testing customer thermal solutions at near the thermal design power Figure 6 shows a decision flowchart for determining thermal solution needs R...

Страница 20: ...Thermal Metrology R 20 Intel E7500 E7505 Chipset MCH Thermal Design Guide This page is intentionally left blank...

Страница 21: ...4 ICH4 Datasheet 6 1 Operating Environment The reference thermal solution was designed assuming a maximum local ambient temperature of 50 C The minimum recommended airflow velocity at the heatsink is...

Страница 22: ...sign Guide Figure 7 Reference Heatsink Volumetric Envelope for the MCH 42 5 mm 1 67 in 42 5 mm 1 67 in 40 mm 1 6 in Tall Heatsink 28 mm 1 1 in Short Heatsink Keep out Zone Above the Motherboard 42 5 m...

Страница 23: ...r soldered to the board Figure 8 shows the reference thermal solution assembly and associated components Figure 9 and Figure 10 show alternate views of the reference solution Full mechanical drawings...

Страница 24: ...erence Thermal Solutions R 24 Intel E7500 E7505 Chipset MCH Thermal Design Guide Figure 9 Reference Thermal Solution Assembly Side View Figure 10 Reference Thermal Solution Top View Ref_Thermal_Soluti...

Страница 25: ...mean airflow direction Simulation and experimental evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are aligned with the mean airflow direction Figure 11 Alignin...

Страница 26: ...for specific tolerances Appendix A lists suppliers for the extruded heatsink Other heatsinks with similar dimensions and increased thermal performance may be available including the tall heatsink show...

Страница 27: ...gasket design may be used instead without any impact to mechanical performance Figure 14 Heatsink Mechanical Gasket Optional Two Piece 42 34 mm 1 667 in 33 20 mm 1 307 in 33 20 mm 1 307 in 42 34 mm 1...

Страница 28: ...soldered to the board like any common through hole header A new anchor design is available with 45 bent leads to increase the anchor attach reliability over time See Appendix A for the part number and...

Страница 29: ...nt Keep out Zones 850_Keepout_Zone 0 896 0 345 0 120 1 156 0 170 0 165 0 100 0 225 2x 0 060 0 345 See Detail A 0 070 Component Keepout 0 100 Component Keepout 0 165 0 100 0 200 0 173 0 345 0 083 2x 0...

Страница 30: ...ines Test Test Profile Pass Fail Criteria Mechanical Shock 50 g board level 11 msec 3 shocks axis Visual Check and Electrical Functional Test Random Vibration 7 3 g board level 45 min axis 50 Hz to 20...

Страница 31: ...nack aol com Monica Chih 866 2 29952666x131 monica_chih ccic com tw Alternate Pin Fin Heatsink Kit 43gm 42 x 42 x 35 mm A69225 002 Foxconn Bob Hall 503 693 3509x235 bhall foxconn com Table 5 Extruded...

Страница 32: ...kennedy boydcorp com Vince Kopec 206 542 8930 vkopec boydcorp com Table 7 Attach Hardware Part Intel Part Number Supplier Contact Information CCI ACK Harry Lin 714 739 5797 hlinack aol com Monica Chih...

Страница 33: ...pendix B Mechanical Drawings R Intel E7500 E7505 Chipset MCH Thermal Design Guide 33 Appendix B Mechanical Drawings This appendix contains the following drawings MCH Heatsink Assembly MCH Heatsink Cli...

Страница 34: ...Appendix B Mechanical Drawings R Intel E7500 E7505 Chipset MCH Thermal Design Guide 34 Figure 17 MCH Heatsink Assembly...

Страница 35: ...Appendix B Mechanical Drawings R Intel E7500 MCH Thermal and Mechanical Design Guidelines 35 Figure 18 MCH Heatsink Clip...

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