Reference Thermal Solutions
R
26
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
6.3.2
Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the E7500/E7505 chipset
MCH components. Figure 12 shows the heatsink profile. This document does not provide
tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists
suppliers for the extruded heatsink. Other heatsinks with similar dimensions and increased thermal
performance may be available, including the tall heatsink shown in Figure 13. Contact your
heatsink supplier for information on alternate heatsinks.
Figure 12. Extruded Heatsink Profile
3.05 mm (0.120 in.)
42.34 mm (1.67 in.)
23.01 mm (0.906 in.)
Extr_Heasink_Profile
NOTE:
Not to scale.
Figure 13. Alternate Tall Heatsink Profile
3.81 mm (0.150 in.)
42.34 mm (1.67 in.)
35.00 mm (1.38 in.)
Alt_Extr_Heatsink_Profile
NOTE:
Not to scale.
