Intel® Server D50TNP Family Integration and Service Guide
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Figure 223. Assembling the Manual Applicator
17.
Assemble the Bergquist SS95407 applicator, Bergquist GF3500S35 thermal gap filler cartridge, and
Bergquist SS95437 nozzle as shown in the above figure.
Figure 224. Applying Center VR Thermal Gap Filler
18.
Using the assembled applicator (see Letter A), apply the thermal gap filler on top of center VR
components (see Letter B).
Note:
Apply enough thermal gap filler (~0.3 cubic centimeters) to fully cover the VR components with a
minimum thickness of 1 mm.
19.
Carefully unpack a new liquid-cooling loop.
20.
Remove the protective covers on the PCIe* add-in card cold plate, CPU 0 and CPU 1 cold plates, and
front VR cold plate.
21.
Ensure the Thermal Interface Material (TIM) for each cold plate is in place and the plastic protective film
is removed.
Important Note:
The liquid cooling loop comes from the factory with a plastic carrier attached. The
carrier is designed to be used during the installation and removal of the liquid cooling loop in the
module. After the liquid cooling loop is installed in the module, the plastic carrier needs to be removed
from it. Keep the plastic carrier for the liquid cooling loop removal if needed in the future.
Содержание D50TNP
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