Intel Celeron D, Руководство по тепловому проектированию

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4
Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Contents
4.2.7.1 Reading the On-Die Thermal Diode Interface........................................ 27
4.2.7.2 Correction Factors for the On-Die Thermal Diode ................................. 27
4.2.8 THERMTRIP# Signal............................................................................................. 28
4.2.8.1
Cooling System Failure Warning ........................................................... 28
4.2.9 How On-Die Thermal Diode, TCONTROL and Thermal Profile Work Together.... 29
4.2.9.1
On-Die Thermal Diode Less than TCONTROL...................................... 29
4.2.9.2 On-Die Thermal Diode Greater than TCONTROL ................................. 29
4.3 Acoustic Fan Speed Control ............................................................................................... 29
5.0 Intel Enabled Thermal Solutions ................................................................................................ 30
5.1 Thermal Solution Requirements ......................................................................................... 30
5.2 ATX Form Factor ................................................................................................................ 31
5.3 1U Form Factor................................................................................................................... 31
5.4 2U Form Factor................................................................................................................... 33
5.5 Reference Thermal Mechanical Solution............................................................................ 35
6.0 Conclusion ................................................................................................................................... 36
A LGA775 Socket Heatsink Loading ............................................................................................. 37
B Heatsink Clip Load Metrology .................................................................................................... 42
C Thermal Interface Management .................................................................................................. 46
D Case Temperature Reference Methodology ............................................................................. 47
E Board Level PWM and Fan Speed Control Requirements ....................................................... 57
F Mechanical Drawings .................................................................................................................. 58
G Vendor Information ..................................................................................................................... 64
Figures
1 Package IHS Load Areas ............................................................................................................. 9
2 Processor Case Temperature Measurement Location ............................................................... 12
3 Example Thermal Profile ............................................................................................................ 13
4 Processor Thermal Characterization Parameter Relationships.................................................. 19
5 Measuring T
LA
— Active Heatsink............................................................................................... 21
6 Measuring T
LA
— Passive Heatsink ............................................................................................ 22
7 Concept for Clocks under Thermal Monitor Control ................................................................... 24
8 Thermal Characterization Parameters for Various Operating Conditions .................................. 31
9 1U Copper Heatsink ................................................................................................................... 32
10 1U Thermal Solution Z-Height Constraints ................................................................................. 33
11 2U Copper Heatsink ................................................................................................................... 33
12 Case-to-Ambient Thermal Characterization Parameter
Ψ
CA
(°C/W).......................................... 34
13 2U Height Restrictions ................................................................................................................ 35
14 Board Deflection Definition ......................................................................................................... 38
15 Example: Defining Heatsink Preload Meeting Board Deflection Limit ........................................ 40
16 Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ................................. 43
17 Load Cell Installation in Machined Heatsink Base Pocket – Side View...................................... 43
18 Preload Test Configuration ......................................................................................................... 44