Intel Celeron D, Руководство по тепловому проектированию

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Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide 7
Order #
303730
Introduction
1.2 References
Material and concepts available in the following documents may be beneficial when reading this
document.
1.3 Terms and Definitions
Table 1. Reference Documents
Document Comment
Fan Specification for 4 Wire PWM Controlled Fans
http://www.formfactors.org/dev
eloper%5Cspecs%5CREV1_2_
Public.pdf
Intel
®
Celeron
®
D Processors 3xx Sequence Datasheet on 90nm Process
in 775-Land Package
Intel document #304092
Intel® Pentium® 4 Processor 570/571, 560/561, 550/551, 540/541, 530/531
and 520/521 Supporting Hyper-Threading Technology Datasheet
Intel document # 302351
Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-Land LGA
Package Thermal Design Guide
Intel document #302553
LGA775 Socket Mechanical Design Guide Intel document #302666
Performance ATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Performance microATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Server System Infrastructure Thin Electronics Bay Specifications http://www.ssiforum.org/
Table 2. Terms and Definitions (Sheet 1 of 2)
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink. Also referred to as T
LA
T
C
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
NOTE: Heat source must be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
C
– T
S
) / Total Package
Power.
NOTE: Heat source must be specified for
Ψ
measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
NOTE: Heat source must be specified for
Ψ
measurements.